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LOCTITE ABLESTIK QMI516IE electrically conductive adhesive is designed for die attach applications. It is a hydrophobic Bismaleimide (BMI) hybrid that is stable at high temperatures and creates a void free bondline.
LOCTITE ABLESTIK QMI516IE is a Snap curable adhesive, designed for high throughput bonding applications. It can cure fast in low temperatures. This adhesive, typically used for heat sensitive devices, cures in low temperatures and exhibits excellent adhesive strength to a variety of substrates.