Product Description
LOCTITE ECCOBOND 3707 UV curable edgebond is designed for bonding various types of electronic components on a PCB. It mainly plays a structural role in the packaging process.
LOCTITE ECCOBOND 3707 is a white, single component epoxy that is typicall used for UV Curable CSP (Chip Scale Packages) and as a BGA (Ball Grid Array) Cornerbond.
UV Cure:
- >3,000mJ or
- >30 seconds @ 100 mW/cm²
Minimum intensity of 100 mW/cm² is recommended for the UV lamp
Oven Cure: