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LOCTITE ECCOBOND 3707 UV curable edgebond is designed for bonding various types of electronic components on a PCB. It mainly plays a structural role in the packaging process.
LOCTITE ECCOBOND 3707 is a white, single component epoxy that is typically used for UV Curable CSP (Chip Scale Packages) and as a BGA (Ball Grid Array) Cornerbond.
Minimum intensity of 100 mW/cm² is recommended for the UV lamp
UV/Light Cure Strengths
UV/Light Cure Limitations