Only signed in users will see discount codes and have complete access to product lines, datasheets and pricelists
LOCTITE® ECCOBOND 50400-1 glob top is designed for encapsulating wire bonded bare die on epoxy laminate and similar substates. The formulation of this single component material ensures a long pot and a very stable, low viscosity during use.
LOCTITE® ECCOBOND 50400-1 is recommended for use on ICs with high wire profiles and in applications where the spreading of the glob top during cure must be controlled.
Low Stress Cure Schedule