Only signed in users will see discount codes and have complete access to product lines, datasheets and pricelists
LOCTITE ECCOBOND FIL 7010C is a low viscosity, one component, SVHC free, epoxy product designed for use as a potting or encapsulation resin protection for stress sensitive electronic components. It is specially formulated with a low thermal expansion and high Tg, along with a toughened polymer backbone making it ideally suited to survive severe thermal shock conditions with a high resistance to micro cracking.
LOCTITE ECCOBOND FIL 7010C is designed to survive constant service temperatures of 150°C, with peak temperatures of up to 180°C for chip on board encapsulation.
Recommended Cure Schedule
Low Stress Cure Schedule
Directions for use