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LOCTITE ECCOBOND E1172A

Harmonization Code : 3506.10.00.00 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Loctite Eccobond 50300HT
Loctite Eccobond 50300HT
Loctite Eccobond 50300HT
Main features
  • Void free Underfill
  • Fast cure at low temperature
  • Long pot life

Product Description

LOCTITE ECCOBOND E 1172 A monocomponent epoxy is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can be used to under-fill devices with 25 micron geometries.

LOCTITE ECCOBOND E 1172 A provides a uniform and void-free underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects. It is a low CTE, non anhydride product with a long pot life. Thermal conductivity still needs TBD but it is around the 0.55 W/mK mark.

 

Cure Schedule

  • 6 minutes @ 135°C
  • 3 minutes @ 150°C
  • 30 minutes @ 100 °C plus 5 minutes @ 135 °C (low stress)
Product Family
E1172A  
10cc Syringe 55cc Syringe

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Not Available Shipping in 8 - 12 weeks
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Pot Life
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.

It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
 48 hours
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C 183 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 35 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
 10 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 15 ppm
Mechanical Properties
Flow rate
Flow rate
The time it takes for the underfill to travel through a gap and onto a glass surface.

Most results are for 1cm distance but always check the TDS for additional information.
100 micron @100°C 16 sec
25 micron @100°C 25 sec
50 micron @100°C 25 sec
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Viscosity 17,000 mPa.s
Electrical Properties
Dielectric Constant
Dielectric Constant
Dielectric Constant (k), commonly known as relative permittivity, is a number relating the ability of a material to carry alternating current to the ability of vacuum to carry alternating current.

It determines the ability of an insulator to store electrical energy and is the ratio of electric permeability in vacuum against the electric permeability of a material.

The lower the dielectric constant (κ) and dissipation factor, the less energy is absorbed from an electric field, making it a much better insulator.

It is a dimensionless property that can be affected by various factors such as the
thickness uniformity of a material, insufficient contact between the sample and electrodes, water adsorption and contact resistance.
Dielectric Constant @ 1000 kHz 3.52/0.0042
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 27 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 135 °C

Additional Information

Testing underfills for Reflow reliability

Here are some anecdotal results from one of our active projects. Please note that these are not official Henkel reliability results but customer outcomes.

We compared 3 Types of underfill with the following curing schedules:

  • FP4531 30min@160°C
  • UF1173 30min@100°C+30min@135°C
  • E1172A  30min@100°C+30min@135°C

We prepared around 20 samples for each underfill. We exposed them to a the temperature profile of normal lead free reflow cycle and tested functionality to see after how many reflow cycles the samples start to fail.

  • FP4531 failed after the first cycle.
  • UF1173 failed after the 2nd cycle 
  • E1172 failed only after the 3rd cycle

 

 

ECCOBOND E 1172 A

ECCOBOND UF 1173

ECCOBOND FP4531

 

PASS

FAIL

PASS

FAIL

PASS

FAIL

1. Oven run

22

0

20

0

18

5

2. Oven run

22

0

19

1

-

-

3. Oven run

21

1

-

-

-

-

 

Does this make E 1172 the superior product and the other ones the inferior? Absolutely not.

These were tested under very specific customer conditions (note the different temperature of FP4531) and are just here to help you have a general outlook and some ballpark figures about these temperatures. These could turn on their heads if the process was different.