Product Description
LOCTITE ECCOBOND E 1172 A monocomponent epoxy is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can be used to under-fill devices with 25 micron geometries.
LOCTITE ECCOBOND E 1172 A provides a uniform and void-free underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects. It is a low CTE, non anhydride product with a long pot life. Thermal conductivity still needs TBD but it is around the 0.55 W/mK mark.
Cure Schedule
- 6 minutes @ 135°C
- 3 minutes @ 150°C
- 30 minutes @ 100 °C plus 5 minutes @ 135 °C (low stress)