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LOCTITE ECCOBOND E 1172 A monocomponent epoxy is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can be used to under-fill devices with 25 micron geometries.
LOCTITE ECCOBOND E 1172 A provides a uniform and void-free underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects. It is a low CTE, non anhydride product with a long pot life. Thermal conductivity still needs TBD but it is around the 0.55 W/mK mark.
Testing underfills for Reflow reliability
Here are some anecdotal results from one of our active projects. Please note that these are not official Henkel reliability results but customer outcomes.We compared 3 Types of underfill with the following curing schedules:
We prepared around 20 samples for each underfill. We exposed them to a the temperature profile of normal lead free reflow cycle and tested functionality to see after how many reflow cycles the samples start to fail.
ECCOBOND E 1172 A
ECCOBOND UF 1173
1. Oven run
2. Oven run
3. Oven run
Does this make E 1172 the superior product and the other ones the inferior? Absolutely not.
These were tested under very specific customer conditions (note the different temperature of FP4531) and are just here to help you have a general outlook and some ballpark figures about these temperatures. These could turn on their heads if the process was different.