Only signed in users will see discount codes and have complete access to product lines, datasheets and pricelists
LOCTITE® ECCOBOND FP4450 Fill encapsulant is designed for protection of bare semiconductor devices. It offers great chemical resistance and pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control.
LOCTITE® ECCOBOND FP4450 is the standard, tried and proven oven cure product with high reliability and hundreds of customers using it. It has lower flow then the FP4450HF (120 vs 25um max filler size) but it does the job great and with a much lower price.