Product Description
LOCTITE® ECCOBOND FP4460 encapsulant is a silica filled, anhydride material designed for the protection of bare semiconductor devices. It is a low stress, low shrinkage and high flow oven cure product that is considered a glob top version of FP4450 with good ionic purity.
LOCTITE® ECCOBOND FP4460 has no JEDEC rating but its pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type.
Cure Schedule