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LOCTITE ECCOBOND FP4470 is a silica/anhydride material (known in the US as CB0260) that features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids.
LOCTITE ECCOBOND FP4470 can withstand solder reflow after being exposed to JEDEC Level 2A (60°C/60% RH, 120 hours) preconditioning. It is a high adhesion version of FP4450 that handles higher solder reflow temperatures when necessary.
LOCTITE ECCOBOND FP4470 should be dispensed onto a substrate warmed to approximately 75°C.