Product Description
LOCTITE® ECCOBOND FP4502 is a high purity, liquid epoxy designed as an underfill for flip chip devices. It is a single component epoxy with low CTE that has an improved toughness and forms a rigid, low stress seal.
LOCTITE® ECCOBOND FP4502 is used to dissipate stress on solder joints, extends thermal cycling performance, is compatible with no clean flux and has improved crack and fracture resistance.
Cure Schedule
- 30 minutes @ 165°C
- 2 minutes, hours @ 150°C