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LOCTITE® ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap. It is a snap curable epoxy with fast flow that passes NASA outgassing standards. LOCTITE® ECCOBOND FP4531 is 62% filled, offers a pretty long pot life and has limited impurities. Its snap cure schedule can vary based on customer's experience and application requirements.
Snap Cure Schedule