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LOCTITE® ECCOBOND FP4651 epoxy encapsulant features very low thermal expansion while retaining syringe dispense capabilities. Its low viscosity and 50 micron maximum particle size gives it improved handling properties over FP4650 for fine wire pitch and cavity-fill applications. It is based on FP4450 resin chemistry, therefore exhibiting excellent chemical resistance and thermal stability properties. With such a high filler rate(82% with 50um max filler size), low CTE and warpage it is essentially a liquid molding compound.
LOCTITE® ECCOBOND FP4651 is a top candidate for a drop in replacement of FP4654 that is slowly being phased out. Even though its viscosity is relatively higher, it is still well within the realms of jetting and dispensing so with the right amount of adjustments to surface and needle heat (and even without them) it should work great as an alternative solution.
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