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LOCTITE ECCOBOND FP 5201 is designed for thermal compression bonding processes in flip chip to laminate assembly. It is a non conductive, high purity hybrid that provides excellent protection on electrical joints.
LOCTITE ECCOBOND FP 5201 is compatible with small assembly gap and tight pitches. A heat curable underfill that works well with solder, Gold and Cu pads on fine pitch laminate substrates
The DSC Cure Kinetics curve shows the cure speed of the FP5201 at temperatures from 120°C up to 240°C