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LOCTITE ECCOBOND LCM 1000AF


Main features
  • SVHC free
  • Ultra Low warpage
  • CTE matching Silica

Product Description

LOCTITE ECCOBOND LCM 1000AF is an epoxy amine based system, used in liquid compression molding and with low stress, exhibiting ultra-low-warpage during wafer-level process, and showing excellent chemical resistance and thermal stability properties. It is a non anhydride, SVHC free encapsulant for wafer level encapsulation.

LOCTITE ECCOBOND LCM 1000AF is a black liquid paste with high purity that is typically used on wafer level packaging and high density (less than 100um die to die) Fan Out applications. Instead of encapsulating the chip post dicing, you encapsulate the entire wafer and dice it afterwards.

LOCTITE ECCOBOND LCM 1000AF presents a breakthrough encapsulation material that leverages a unique anhydride-free resin platform to enable thorough protection, improved warpage control and fine gap filling for fan-in and fan-out wafer-level packages (FI WLPs, FO WLPs). LOCTITE ECCOBOND LCM 1000AF, which is REACH-compliant, has shown effective reliability-enhancing performance in internal evaluations of several wafer-level packaging configurations including FI WLPs, embedded wafer-level ball grid arrays (eWLBs), FO WLPs, and chip-on-wafer (CoW) encapsulation.

LOCTITE ECCOBOND LCM 1000AF is a solvent-free encapsulant that integrates exceptionally fine particle fillers (average 3 µm, upper cut 10 µm), enabling high-yield, ultra-low warpage, excellent flow properties for void-free fine-dimension filling, and fast in-mold cure times for improved UPH. In testing, LOCTITE ECCOBOND LCM 1000AF exhibited the following performance benefits:

  • Ultra-low Warpage of  –When evaluated on an 8” wafer, Henkel’s LCM resulted in extremely low wafer warpage of 0.66 mm after post-mold curing.
  • Void-free Fine Gap Filling – Formulated with finer particles, LOCTITE ECCOBOND LCM 1000AF quickly penetrates narrow trenches between die (FI WLP process), and is able to fill a 40 µm x 400 µm trench with no voids.
  • High Throughput – Lab evaluation confirmed the material’s high throughput capability, with the Henkel LCM achieving an in-mold cure time of five minutes.
 

Cure Schedule

  • 5min @ 120°C (In mold cure)
  • 1hour @ 150°C (Post mold cure) 

 

Product Family
LCM1000AF  
6oz Cartridge

Catalog Product

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Technical Specifications

Mechanical Properties
Storage (DMA) Modulus
Storage (DMA) Modulus @ 25°C 16000 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
6 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
17 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
158 °C

Additional Information

As chip integration and new packaging technologies gain steam to address the cost, form factor and functional realities of accelerated electronics miniaturization, FO WLP and FI WLP approaches are increasingly being adopted, particularly for applications such as data processors, mobile devices, consumer electronics, and radio-frequency communication chipsets.  However, with thinner dies – some as thin as 50 µm or less –conventional anhydride-based molding materials may not meet today’s challenging requirements.

Traditional liquid compression molding materials are built on anhydride resin systems with larger filler sizes, which can limit warpage control effectiveness in FO WLP processes and the ability to penetrate narrow gaps for trench filling with FI WLP techniques. The powder-type fillers often used in older-generation standard wafer encapsulation systems have large particle sizes that range from 25 µm to an upper cut of 50 µm while some of the trenches between dies in FI WLP processes are as thin as 40 µm wide. Standard encapsulants are challenged to thoroughly fill high-density structures and, during fan-out wafer-level processing, have also shown warpage of greater than 2.0 mm after molding, both factors that can impact long-term reliability and wafer handling.  Henkel’s anhydride-free epoxy liquid compression molding material resolves these issues.   

The ultra-low warpage, improved handling, high throughput processing, thorough five- or six-side protection and void-free performance of our new LCM serve to dramatically enhance reliability and long-term device durability. At the same time, LOCTITE ECCOBOND 1000AF delivers these attributes in an anhydride-free formulation that complies with strict REACH standards and in keeping with Henkel’s commitment to sustainability. Wafer-level packaging just took a huge leap forward.

 

Liquid compression molding for FanOut WLP

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How can we improve LCM1000AF adhesion to the die back side?

To improve the adhesion of LCM 1000AF to the back side of the die, you may consider a rougher surface to increase the bonding surface area. This may be achieved by rougher back grinding process.

If this is not an option then you can consider the following:

  1. Populate the whole  panel area with Si carrier squares (instead of only a few squares, typically used for first trials). Total warpage and tensile stress are expected to go down.
  2. Change the FR4 carrier material to a lower CTE material. Same here. Total warpage and tensile stress are expected to decrease.

Last but not least, curing the parts longer for 10 minutes at 120C (instead of 5 minutes on TDS) can aid in reducing the stress. This way a higher modulus, more than 10 MPa, is achieved in the mold.

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DMA and TMA curves of LCM 1000AF

 

LCM1000AF (X19Dec19) 

DSC

DMA

Durometer

IMC

PMC

Degree of Cure

Modulus @25, GPa

Tg (Tan delta)

Hardness
Shore D

110℃ 600s

-

56%

6.3

85

81

150℃ 1hr

100%

14.6

155

95

120℃ 300s

-

54%

5.7

83

79

150℃ 1hr

100%

13.2

146

94

120℃ 450s

-

55%

9.6

80

85

150℃ 1hr

100%

14.5

161

94

120℃ 600s

-

72%

11.7

93

88

150℃ 1hr

100%

14.0

173

95