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LOCTITE® ECCOBOND NCP 5209 is a non-conductive paste (NCP) underfill designed to facilitate next-generation fine-pitch copper pillar and copper OSP flip-chip devices. Overcoming the voiding and protection drawbacks of conventional capillary underfills, LOCTITE ECCOBOND NCP 5209 leverages thermal compression (TC) bonding to offer robust, complete bump protection of flip-chip devices, with bump pitches less than 100 µm and gaps less than 40 µm for a high-reliability result.
LOCTITE® ECCOBOND® NCP 5209 is a fast curing hybrid adhesive has improved fluxing and stability at 70°C up to 60 minutes and has been proven a high volume runner with long staging time (>60 min 70°C). With a Typical TCB cure within 2-4 seconds @ 240-280°C, High Tg of 180°C and low ionics (<5ppm) it achieves a longer stage life and better flowability than its direct rival, LOCTITE ECCOBOND FP 5201.
Its fast cure resin, improved solderability and good reliability make it ideal for high volume production and make it the #1 Non Conductive Paste Underfill of choice.
The DSC Cure Kinetics curve shows the cure speed of the NCP5209 at temperatures from 120°C up to 240°C