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LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages.
LOCTITE® ECCOBOND UF 1173 is a one-component underfill that can be jet or needle dispensed, flows fast in and around tight interspaces and cures quickly to form void-free interconnect protection from shock, drop and vibration. Importantly, the novel underfill exhibits high glass transition (Tg) temperature capability of 155°C and a low coefficient of thermal expansion (CTE) to ensure robust protection performance even under stressful conditions.
LOCTITE® ECCOBOND UF 1173 material has been formulated without any reportable REACH SVHCs (current to June 2018) and the product is not CMR classified.
Terms permittivity (Dk) and loss tangent (Df) for UF 1173 - Open ended coaxial probe