Product Description
LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages.
LOCTITE® ECCOBOND UF 1173 is a one-component underfill that can be jet or needle dispensed, flows fast in and around tight interspaces and cures quickly to form void-free interconnect protection from shock, drop and vibration. Importantly, the novel underfill exhibits high glass transition (Tg) temperature capability of 155°C and a low coefficient of thermal expansion (CTE) to ensure robust protection performance even under stressful conditions.
LOCTITE® ECCOBOND UF 1173 material has been formulated without any reportable REACH SVHCs (current to June 2018) and the product is not CMR classified.
Cure Schedule