Only signed in users will see discount codes and have complete access to product lines, datasheets and pricelists
LOCTITE® ECCOBOND UF 3810 reworkable, epoxy underfill is designed for CSP and BGA applications. It has high Tg and has stable electrical performance in temperature himidity bias. This material cures quickly at moderate temperatures to minimize stress to other components. When cured, it provides excellent mechanical properties to protect solder joints during thermal cycling.
LOCTITE® ECCOBOND UF 3810 is a single component, halogen free black material, compatible with most Pb-free solders. It can flow in temperature and cure fast at moderate temperatures.