Product Description
LOCTITE ECCOBOND UF 3820 reworkable underfill is specially designed for CSP, WLCSP and BGA applications. It is formulated to cure quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
LOCTITE ECCOBOND UF 3820 is a high TG, easy to rework epoxy that cures fast at moderate temperatures. It is capable of flowing at room temperature and offer high fracture toughness and excellent thermal cycle performance.
Cure Schedule
- 10 minutes @ 130°C
- 5 minutes @ 150°C or
- 3 minutes @ 160°C