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LOCTITE ECCOBOND UF 3915 reworkable underfill is specially designed for WLCSP (Wafer level chip scale packages) and flip chip device applications. It is a Halogen free, one component underfill that can be snap cured @ 160°C.
LOCTITE ECCOBOND UF 3915 has a High Glass transition temperature of 125°C while also demonstrating high fracture toughness and excellent thermal cycle performance. It is electrically stable under thermal and humidity bias and it is compatible with most Pb free solders