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LOCTITE ECCOBOND UF 3915 reworkable underfill is specially designed for WLCSP (Wafer level chip scale packages) and flip chip device applications. It is a Halogen free, one component underfill that can be snap cured @ 160°C.
LOCTITE ECCOBOND UF 3915 has a High Glass transition temperature of 125°C while also demonstrating high fracture toughness and excellent thermal cycle performance. It is electrically stable under thermal and humidity bias and it is compatible with most Pb free solders
Recommended Snap cure schedule
Alternate cure schedule