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Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • UV & Moisture Cure
  • Cures in shadowed areas
  • Translucent light blue

Product Description

LOCTITE ECCOBOND UV 9060F no flow encapsulant is designed for local circuit board protection as a UV curing coating/encapsulant with secondary moisture cure in shadow areas. This product is fluorescent when viewed with ultraviolet (black) light.

LOCTITE ECCOBOND UV 9060F is a one component, fast curable translucent material that is easily dispensed without stringing. It is fluorescent under UV light and it typically used for assembly applications and the local protection of WLCSP and BGA on circuit boards.


Recommended UV Cure

Light Source and Condition:

  • Metal halide doped spectrum UV lamp
  • Lamp Power, W/in 300
  • Distance between lamp to substrate, inches 4
  • Irradiance UVA, EIT puck radiometer, mW/cmÇ 566
  • Recommended Dose, seconds 5 to 25

Moisture cures occurs at ambient temperature and humidity.

*Cures at least 0.25 inch under optimum conditions.


Product Family
55cc Syringe

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Not Available Shipping in 8 - 12 weeks

Technical Specifications

General Properties
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 180 days
Mechanical Properties
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Viscosity 11,000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
75 °C
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
82 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
198 ppm/°C