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LTM6300-SP | Phase Change Paste

Harmonization Code : 3824.99.96.99 |   Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
  • 0.12 - 0.14 Thermal Impedance
  • 1.8 - 2.4 Thermal Conductivity
  • Highest volume resistivity

Product Description

LTM6300-SP is the entry level Honeywell's thermally conductive phase change Stencil printable paste. This paste is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. In addition to that it has excellent electrical properties and the highest volume resistivity of the entire phase change product line.
 
LTM6300-SP has a Thermal conductivity of 1.8 - 2.4 (W/m·K) depending on the bondline thickness and is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.12-0.14) , making it desirable for high-performance integrated circuit devices.
Product Family
LTM6300-SP  
1Kg Jar

Catalog Product

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Technical Specifications

General Properties
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.8
Thickness range 0.20 - 1.00 mm
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
3.0x1015 Ohms⋅cm
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.8 - 2.4 W/m.K
Thermal Impedance 0.12 - 0.14 °C·cm²/W