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MCL-C2000 | Melamine Compression Cleaning Compound

Harmonization Code : 3909.20.10 | Melamine Formaldehyde Resin

Main features

Compression Grade
For transfer molding equipment
0.1% Formaldehyde

Product Description

SolEpoxy™ MCL-C2000 is a compression-grade melamine mold cleaning compound designed for cleaning transfer molding equipment and epoxy molds. MCL-C2000 molds very easily and effectively. Most cleaning processes need no more than three shots to completely clean molds of all stains and residues.

MCL-C2000 can be supplied in loose powder or as square preforms, each with an easy break center “V-Groove,” which can be used for applications requiring smaller charge sizes. Powder or preforms are supplied in three-gallon plastic pails containing 20 lbs per pail.

MCL-C2000 is a compression grade melamine mold compound designed for the cleaning of mold stain deposited during the molding of epoxy molding compound for encapsulation of leadframe products like capacitors, resistors or semiconductor IC chips.

Technical Specifications

General Properties

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.5

Color

Color
The color

White

Compression Pressure

10 Kg/cm2

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	730 days

Thermal Properties

Spiral Flow
Spiral Flow @ 175°C	7.62 cm

Other Properties

RoHS Compliant

RoHS Compliant
RoHS is a product level compliance based on a European Union Directive which restricts the Use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS).

Products compliant with this directive do not exceed the allowable amounts of the following restricted materials: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), with some limited exemptions

Yes

Curing Conditions

Mold Temperature

150 - 190 °C

Curing Schedule

Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.

Cure Time

2 - 5 min

Additional Information

Mold cleaning procedure

Before molding any new material or at the beginning of a new molding cycle, it is ESSENTIAL that the mold be completely clean from the previous molding.

This point becomes more important for matte finish molds as residue can be lodged in the charmill which is undetectable to the naked eye. Any routine mold cleaning procedure should insure that the mold is perfectly clean before beginning the next cycle. If more that 8 cleaning shots are necessary, the cleaning frequency should probably be increased. For new molding compound trials, extra care should be taken since many materials are incompatible and even the slightest residue could hinder the evaluation or lead to misinterpretation of the results.

The compression mold cleaning process is the most effective for cleaning molds with large cavities and long or double runner systems. It is also the only method that will clean land areas and mold vents. A generally acceptable mold cleaning procedure for MCL-C2000 is as follows:

In most cases, MCL-C2000 can be used at normal molding temperatures. The recommended range is 150–190°C. Before starting the cleaning process, the press clamping pressure should be reduced to 10 tons maximum.
Place MCL-C2000 squares adjacent to each other over the cavity and runner area of the lower half of the mold. To reduce waste, the preforms may be broken in half as long as the area to be cleaned is covered by preforms. Material may be placed in the transfer pot in order to clean this and the plunger face.
Set press to manual mode and close mold halves until the compound just touches the top half of the mold. Wait for 5 seconds and then completely close the mold halves. Excess material will squeeze out from the parting line of the mold. If cleaning material is placed in the transfer pot, the plunger sequence should be activated once the mold is completely closed.
Cure the cleaning compound for 2 minutes. Cleaning is generally more effective with longer curing time. For extremely dirty molds, the cycle time can be extended for up to 5 minutes.
Open the mold and remove all cured material from cavities, runners, gates, land areas, and vents. It is also important to check relief areas, as compound left in these holes could cause damage to locating pins.
Inspect the cured cleaning material for discoloration and repeat steps 2 to 5 until the material is free from stain.
Once the mold is clean, return the press to standard process conditions and prepare the mold by applying a thin wax layer and molding 3 to 5 shots of conditioning compound or 3 to 5 dummy shots of standard mold compound using 2 to 3 times the normal curing cycle time.
Resume normal molding. The first three shots of standard molding compound should be cured 2 to 3 times longer than normal in order to insure that press equilibrium and optimum release characteristics are achieved.