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Non Conductive Adhesives

Thermally and chemically resistant

AVAILABLE DIRECTLY AT CAPLINQ.COM

Non Conductive Adhesives

Non conductive adhesives can withstand high thermal loads and can potentially provide high shock and peel resistance. They demonstrate excellent chemical resistance, thermal shock and impact resistance while also maintaining a wide operating temperature range.

Our range of Non conductive adhesives (NCA) can achieve great bonding to a variety of substrates while also being thermally and chemically resistant.These Henkel adhesives are designed for us in temperature sensitive electronics such as CMOS image sensors and in high throughput assembly that requires low temperature cure. With an operating temperature range between -40ºC to 130ºC they are ideal for substrate attachment and can be used for lens holder, lens barrel and IR filter bonding.

NCA dual cure adhesives provide improved adhesion to LCP and aluminium for automotive applications and they can be used for automatic dispensing, screen printing and led applications. Their flexibility derives from the fact that they can be dual cured but can also be used either as a single component or two component epoxies with a resin and a catalyst.

Compare Products
16 products
  • LOCTITE 3128
    Catalog Product

    LOCTITE 3128

    • One component
    • Low temperature cure
    • Bonding heat sensitive components
    • 8 - 12 weeks
  • LOCTITE 3217
    Catalog Product

    LOCTITE 3217

    • UV & Heat Cure
    • Non Conductive
    • Image sensor module assemblies
    • 8 - 12 weeks
  • LOCTITE 3616
    Catalog Product

    LOCTITE 3616

    • One component
    • High wet strength
    • SMD to PCB adhesive
    • 8 - 12 weeks
  • LOCTITE 3621
    Catalog Product

    LOCTITE 3621

    • One component
    • Chipbonder
    • Very High dispense speed
    • 8 - 12 weeks
  • LOCTITE 3703
    Catalog Product

    LOCTITE 3703

    • UV & Visible light Cure
    • High speed curing
    • Excellent adhesion
    • 8 - 12 weeks
  • LOCTITE AA 3106
    Catalog Product

    LOCTITE AA 3106

    • Transparent liquid
    • UV & Visible light cure
    • Enhances shock absorption
    • 8 - 12 weeks
  • LOCTITE AA3526
    Catalog Product

    LOCTITE AA 3526

    • Translucent
    • Cures rapidly
    • Excellent adhesion to glass, plastics and metals
    • 8 - 12 weeks
  • LOCTITE ABLESTIK 2332
    Catalog Product

    LOCTITE ABLESTIK 2332

    • One component
    • Excellent adhesion
    • High strength
    • 8 - 12 weeks
  • LOCTITE ABLESTIK G500
    Catalog Product

    LOCTITE ABLESTIK G500

    • One component
    • General purpose
    • Sag resistant
    • 8 - 12 weeks
  • LOCTITE ABLESTIK NCA 2286
    Catalog Product

    LOCTITE ABLESTIK NCA 2286

    • Dual Cure
    • High elongation strength
    • Active alignment in lens holder attach
    • 8 - 12 weeks
  • LOCTITE ABLESTIK TE3530
    Catalog Product

    LOCTITE ABLESTIK TE3530

    • One component
    • Thermally conductive
    • Low viscosity
    • 8 - 12 weeks
  • LOCTITE DSP 190024
    Catalog Product

    LOCTITE DSP 190024

    • UV Cure
    • Bone white translucent
    • Sealant for displays
    • 8 - 12 weeks
  • LOCTITE 3217
    Catalog Product

    LOCTITE ECCOBOND 3707

    • UV & Heat cure
    • One component
    • BGA cornerbond
    • 8 - 12 weeks
  • LOCTITE HHD 3607BK
    Catalog Product

    LOCTITE HHD 3607BK

    • Jettable PUR
    • Moisture cure
    • High adhesion strength
    • 8 - 12 weeks
  • LOCTITE SF 7360
    Catalog Product

    LOCTITE SF 7360

    • Low odor
    • Stencil and Nozzle cleaner
    • Compatible with epoxy adhesives
    • 8 - 12 weeks
  • Honeywell TA 3000
    Catalog Product

    Honeywell TA 3000

    • Moisture cure
    • Good thermal performance
    • Adjusts to irregular surfaces
    • 8 - 12 weeks
Compare Products
16 products

Product Selector Guide

Non Conductive Adhesives
Product Specific Gravity Hardness Viscosity (mPA*s) Glass transition temperature (°C) CTE a1 CTE a2 Recommended cure Attributes
Loctite 3128 1.6 88 27,000 45 40 130 60min @60°C Memory cards, CCD/CMOS Assemblies and Lid/Cap attach for optical sensors and 3d sensing modules.
Loctite 3217  1.2 86 109,000 82 53 178 30min @60°C  Optical applications and the cavity fill of test IC's.
Loctite 3616 1.33 - 25,000 140 86 - 90sec @150°C Bonding of surface mounted devices to printed circuit boards prior to wave soldering.
Loctite 3621 1.22 - 3,000 110 100 218 30min @150°C Chipbonder. Suited for applications with very high dispense speeds and high dot profile.
Loctite 3703 1.12  - 20,000  - - - 10sec @6 mW/cm2 PVC to polycarbonate for large gap filling (0.25mm) and a flexible joint.
Loctite AA 3106 1.08  53 5,000 - - - 15sec @6 mW/cm2 Excellent adhesion to glass, many plastics and most metals.
Loctite AA 3526 1.06 62 17,500 36 - 5sec @6 mW/cm2 UV/visible light-cured, liquid modified acrylic adhesive.
Loctite Ablestik 2332 1.17 75 70,000 105  100 - 60min @120°C Universal adhesive that can be used, among others, for SMD components, caps and lids.
Loctite Ablestik G500 86 - - - - 60min @125°C General purpose epoxy adhesive and sealant that cures to a high gloss finish.
Loctite Ablestik NCA 2286 - 85 40,000 28 55 165 4sec @220nm Use in active alignment applications in camera module assembly.
Loctite Ablestik TE3530 - - 60,000 - 36 - 30min at 100°C Bonding heat dissipation components and applied by automatic syringe dispense (2.3 W/mK)
Loctite DSP 190024 1.12 - 20,000 - - - 10sec at 365nm UV curable sealant for displays. Cured by exposure to UV and/or visible light 
Loctite Eccobond 3707 - - 9,595 53 52 151 30sec @100 mW/cm2 UV + Heat Curable edgebond designed for bonding  electronic components on a PCB.
Loctite HHD 3607BK - 75 6,500  - - - Moisture Moisture curable reactive polyurethane for glass surfaces
Loctite SF 7360 - - - - - - - Cleaner for uncured adhesive and adhesive residues found following PCB assembly.  Fully compatible with epoxy adhesives

*UV Cure Values are indicative of the fixture step. Check the TDS for more information.


Frequently Asked Questions

Why would I want to Dual cure my product?


Dual cure products are formulated to temporarily cure when exposed to UV light, followed with a secondary thermal cure at low temperature. Temporarily curing the material allows for any necessary adjustments to the final device configuration.

What are the benefits of two component adhesives?


Two-component non conductive adhesives require no refrigeration or freezer storage and include products that provide high peel and tensile lap shear strength over a broad temperature range. Two component epoxies are not premixed so they eliminate pot life issues making them easier to use, transfer, store and preserve.


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Adhesives for CMOS & 3D Image sensors

Key requirements for adhesives that can be used in sensor bonding are:

  • Adhesion to variety of substrates (PC, LCP, etc.)
  • Low temperature cure - below 100°C
  • Fast cure - below 60mins
  • Operating temperature range -40ºC to 130ºC
  • Low halogen content

We offer a wide range of adhesives that are suitable as Lens Holder, Lens Barrel and IR Filter bonding. Depending on the process there are adhesives that are stencil printable or dispensable, UV, Heat or Dual cure and with a high range of viscosity and thixotropy ratings.

The usual process for such bonding starts with dispensing the adhesive and then positioning and aligning the component. Next steps usually consist of fixating the component with light cure that is then finalized with Heat curing.Hence the need for dual curing. It is not necessary but it is process dependent and can help with the precision alignment steps.

CMOS sensor bonding process