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Non Conductive Adhesives

Thermally and chemically resistant

AVAILABLE DIRECTLY AT CAPLINQ.COM

Non Conductive Adhesives

Non conductive adhesives can withstand high thermal loads and can potentially provide high shock and peel resistance. They demonstrate excellent chemical resistance, thermal shock and impact resistance while also maintaining a wide operating temperature range.

Our range of Non conductive adhesives (NCA) can achieve great bonding to a variety of substrates while also being thermally and chemically resistant.These Henkel adhesives are designed for us in temperature sensitive electronics such as CMOS image sensors and in high throughput assembly that requires low temperature cure. With an operating temperature range between -40ºC to 130ºC they are ideal for substrate attachment and can be used for lens holder, lens barrel and IR filter bonding.

NCA dual cure adhesives provide improved adhesion to LCP and aluminium for automotive applications and they can be used for automatic dispensing, screen printing and led applications. Their flexibility derives from the fact that they can be dual cured but can also be used either as a single component or two component epoxies with a resin and a catalyst.

Compare Products
9 products
  • LOCTITE ABLESTIK TE3530
    Catalog Product

    LOCTITE ABLESTIK TE3530

    • One component
    • Thermally conductive
    • Low viscosity
    • 8 - 12 weeks
  • LOCTITE 3217
    Catalog Product

    LOCTITE 3217

    • UV & Heat Cure
    • Non Conductive
    • Image sensor module assemblies
    • 8 - 12 weeks
  • LOCTITE 3128
    Catalog Product

    LOCTITE 3128

    • One component
    • Low temperature cure
    • Bonding heat sensitive components
    • 8 - 12 weeks
  • LOCTITE 3217
    Catalog Product

    LOCTITE ECCOBOND 3707

    • UV & Heat cure
    • One component
    • BGA cornerbond
    • 8 - 12 weeks
  • LOCTITE AA3526
    Catalog Product

    LOCTITE AA 3526

    • Translucent
    • Cures rapidly
    • Excellent adhesion to glass, plastics and metals
    • In stock
  • LOCTITE ABLESTIK 2332
    Catalog Product

    LOCTITE ABLESTIK 2332

    • One component
    • Excellent adhesion
    • High strength
    • 8 - 12 weeks
  • LOCTITE ABLESTIK G500
    Catalog Product

    LOCTITE ABLESTIK G500

    • One component
    • General purpose
    • Sag resistant
    • 8 - 12 weeks
  • LOCTITE 3621
    Catalog Product

    LOCTITE 3621

    • One component
    • Chipbonder
    • Very High dispense speed
    • 8 - 12 weeks
  • LOCTITE HHD 3607BK
    Catalog Product

    LOCTITE HHD 3607BK

    • Jettable PUR
    • Moisture cure
    • High adhesion strength
    • 8 - 12 weeks
Compare Products
9 products

Frequently Asked Questions

Why would I want to Dual cure my product?


Dual cure products are formulated to temporarily cure when exposed to UV light, followed with a secondary thermal cure at low temperature. Temporarily curing the material allows for any necessary adjustments to the final device configuration.

What are the benefits of two component adhesives?


Two-component non conductive adhesives require no refrigeration or freezer storage and include products that provide high peel and tensile lap shear strength over a broad temperature range. Two component epoxies are not premixed so they eliminate pot life issues making them easier to use, transfer, store and preserve.


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Adhesives for CMOS & 3D Image sensors

Key requirements for adhesives that can be used in sensor bonding are:

  • Adhesion to variety of substrates (PC, LCP, etc.)
  • Low temperature cure - below 100°C
  • Fast cure - below 60mins
  • Operating temperature range -40ºC to 130ºC
  • Low halogen content

We offer a wide range of adhesives that are suitable as Lens Holder, Lens Barrel and IR Filter bonding. Depending on the process there are adhesives that are stencil printable or dispensable, UV, Heat or Dual cure and with a high range of viscosity and thixotropy ratings.

The usual process for such bonding starts with dispensing the adhesive and then positioning and aligning the component. Next steps usually consist of fixating the component with light cure that is then finalized with Heat curing.Hence the need for dual curing. It is not necessary but it is process dependent and can help with the precision alignment steps.

CMOS sensor bonding process