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Thermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability but they they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces.
Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad, without the potential problems of either. Thermal Hybrid is prepared as a silicone polymer, with low molecular siloxane, and mixed with high thermal conductivity particles (such as alumina, aluminum nitride powder, etc.).
Compared with thermal grease, the main difference is that thermal Hybrid does not present oil separation issues while in storage, and the Hybrid can be torn off and reused. Thermal Hybrid only needs a relatively low working pressure when connected with heat sink and chip, and has a wide working temperature range. Single part hybrid thermal gels exhibit exquisite oil bleeding properties and find some of their main applications in consumer electronics, automotive vehicle control systems, EV batteries, networking devices and applications that require horizontal mount. Used from major manufacturers, HT series products perform incredibly well with a tiny amount of material.
The HT series, our one-part hybrid Gap Filler, provides effective thermal properties and high conformability along with its high compressibility. It is formulated to deliver high dispense rates for improved productivity, long-term reliability performance and easy re-workability. It is designed to minimize thermal resistance at interfaces, maintain its performance through reliability testing, and provide scalable application at a competitive cost. All HT series products are available in 280cc aluminum cartridge, and 1 and 5-gallon pail.
*Since those are top of the line products, we go to certain extends to protect Honeywell's IP and competitive advantages. A plethora of information, including additional data, images and samples are available once an NDA is in place. Contact us for more details. (Yes, they are exceptional)
**Typical values for electrical properties on our high end products are: Dielectric constant@1MHz: 9 and Volume resistivity: 1013Ω*cm
**Lower conductivity materials have much lower filler content and therefore have even higher volume resistivity which makes them more insulative.
You can but you most likely don't want to. One part gap fillers are easily dispensable and reworkable while also requiring no mixing, additional curing or low temperature storage.
The no cure nature of the fully cross linked one part thermal gel results in relatively lower adhesion, making it less ideal for vertical applications. This changes when screws or clamps are involved in the assembly. In that case it can be a proper and effective solution. Otherwise we will suggest to take a look at our Two part thermal gap fillers, ideal for vertical application.
Typical Single part hybrid gap filler Applications include:
That's an odd question since the challenge is always to achieve the thinnest bondline thickness. Maximum BLT is mostly a matter of surface area and avoiding slumping. We have tested all of our one and two part hybrid gels and can confidently say that you can reach 1-5mm maximum bond line thickness without slumping.
All of our product properties are tested based on strict and regulated test method standards such as the ASTM. The test method always accompanies the product properties. We try to undershoot rather than overshoot the product capabilities so that you always get at least the advertised properties (and usually much better than that). We pride ourselves in providing "spot on" stated properties.
Thermal conductivity is an easy way to categorize products and it is true that this is the leading property in our product nomenclature. At the end of the day though, Thermal impedance is what makes the real difference. That's why most of our technical discussions revolve around these values. In order to test it we have implemented various methodologies such as the Cut bar method that is demonstrated in this image.
This methodology is based on ASTM D5470 (at the time this content was written) and is a destructive, one time test with fast and immediate results. One of the most common methodologies that we use for Thermal impedance.
Another test, suitable for accelerated life testing, is the Laser flash method. With ASTM 1461 (current) we measure the thermal impedance between Si, Ni plated Cu surfaces.This method includes the CTE mismatch and the actual surface finish.
Laser flash takes thermal diffusivity into account and the calculation follows the logic in the image. Typical coupons used are:
Please note that these methodologies are not strictly limited to one part hybrid thermal gels but they also extend to out entire thermal interface product line, when applicable.