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PTM5000-SP has a Thermal conductivity of 3.5 - 4.5 (W/m·K) depending on the bondline thickness and is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.06-0.08) , making it desirable for high-performance integrated circuit devices.
When choosing a printable paste it is important to understand the process parameters and limitations.
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