Shopping cart overview
Your Cart is currently empty.

Shopping cart overview

Your Cart is currently empty.

PTM5000-SP | Phase Change Paste

Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other

Main features

0.06 - 0.08 Thermal Impedance
3.5 - 4.5 Thermal Conductivity
Stencil Printable

Product Description

PTM5000-SP is Honeywell's thermally conductive phase change paste, which is available in Stencil printable form. It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications.

PTM5000-SP has a Thermal conductivity of 3.5 - 4.5 (W/m·K) depending on the bondline thickness and is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.06-0.08) , making it desirable for high-performance integrated circuit devices.

Technical Specifications

General Properties
Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.	2.3
Thickness range	0.20 - 1.00 mm
Electrical Properties
Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.	3.0x10¹⁵ Ohms⋅cm
Thermal Properties
Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.	3.5 - 4.5 W/m.K
Thermal Impedance	0.06 - 0.08 °C·cm²/W

Additional Information

When choosing a printable paste it is important to understand the process parameters and limitations.

That's why we ask, when you contact us, to include the following information:

What is your print thickness?
How long is your printing time and working window?
What is your drying step after printing?
- Temperature (Room temperature or something else?)
- Time
Do you have any viscosity limitations in the printing process?