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PTM6000 has almost identical properties to PTM5000 but it is a higher reliability version . It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. As with all Phase change materials, it has stable Thermal Impedance across accelerated aging tests and does not display bleed, pump or flow out
PTM6000 has a Thermal conductivity of 3.5 - 4.5 (W/m·K) depending on the bondline thickness and is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.06-0.08) , making it desirable for high-performance integrated circuit devices.
BLT vs TI for various Phase change materials
150°C HTS trend for PTM6000