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PTM6000HV-SP | Phase Change Paste

Harmonization Code : 3824.99.96.99 |   Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
  • 0.14 Thermal Impedance
  • 5.2 Thermal Conductivity
  • Optimized for IGBT

Product Description

PTM6000HV-SP, commonly known as PTM6000HV, is a highly thermally conductive Phase Change Material (PCM) in paste format. This High viscosity(HV) version of PTM6000-SP is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. It has a very wide process window that makes it an optimal, tailor made option for IGBT printing and honeycomb structures.

PTM6000HV-SP is based on a robust polymer PCM structure and exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. 

PTM6000HV-SP is a proprietary material that provides superior reliability (pass 150˚C baking 2000 hours, temperature cycling 2000 cycles, and HAST 288 hours) and maintains low thermal impedance (<0.12˚Ccm2/W no shim), making PTM6000HV desirable for high-performance integrated circuit devices.

Product Family
PTM6000HV-SP  
1Kg Jar 280cc Al cartridge

Catalog Product

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Technical Specifications

General Properties
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.6
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
2.1x1014 Ohms⋅cm
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
5.2 W/m.K
Thermal Impedance 0.09 °C·cm2/W

Additional Information

Product Use
Clamping pressure and temperature are suggested to achieve a minimum bond line thickness of the thermal interface material, typically less than 1.5 mil (0.038mm) for best performance.
The material must go through the phase change temperature to exhibit entitlement performance.
 
 
THERMAL IMPEDANCE POST RELIABILITY
(ASTM E1461)
 
End of Line
0.10˚C-cm2/W
 
Bake 125˚C, 2000 h 0.09˚C-cm2/W
Bake 150˚C, 2000 h 0.09˚C-cm2/W
HAST, 288h 0.09˚C-cm2/W
Temperature Cycling “B” 
(-55˚C to +125˚C, 2000 cycles)
0.07˚C-cm2/W
 
 
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PTM6000HV has been formulated with IGBT in mind.
Its high viscosity and Wide process windows have been developed specifically to aid IGBT applications, making it the most optimized IGBT material in the market.
 
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