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Semi sintering die attach pastes

Semi sintering die attach adhesives for semiconductor packaging


Semi Sintering Die Attach Pastes

Semi sintering die attach pastes are drop in solutions, identical to standard die attach paste applications but without the need for high pressure and temperature for sintering. They are characterized by excellent workability, allowing for consistent dispensing for 24 continuous hours, without silver settling or separation.

Lead-free die attach materials that offer simplified processing, robust reliability and best-in-class thermal and electrical performance for high power density semiconductor packages.

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Smaller, higher functioning devices within applications in various market sectors are increasing power densities and driving the need for more effective heat dissipation. While thermal interface materials offer this capability at the board and component level, more user-friendly and effective thermal management solutions are needed at the die level.

Henkel's new series of high thermal semi-sintering die attach materials enable robust package-level sintering and overcome the regulatory challenges of solder, thermal conductivity limitations of traditional die attach materials, and processability complexities of pure sintering pastes. The LOCTITE® ABLESTIK® ABP 8068T portfolio are high thermal, semi-sintering die attach pastes that offer simplified processing, and best-in-class thermal and electrical performance with robust reliability for today’s high power density devices.