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Transistors

Transistors

MOSFETS, TOS and BJTS

Switches and Amplifiers

Transistor Outline (TO)

TO-252, also known as DPAK, is a semiconductor package developed for surface mounting on circuit boards. It represents a surface-mount variant of TO-251 package, and smaller variant of the D2PAK package, also known as TO-263. DPAK is suitable for medium-power applications (reference values 80W*/60A), while D2PAK is for higher power application (reference values 100A).
A common Bill Of Materials would include a Ni plated copper leadframe, Pb solder die attach, Al wire for the intereconnects and a molding compound to keep it all together.


Typical Applications

The DPAK/D2PAK package is suitable for medium/high power applications designed for low on-resistance and high-speed switching MOSFETs, such as:

  • motor drivers
  • power supply circuits
  • DC-DC converters,
  • consumer and automotive products.

Typical Reliability test

  • JEDEC standard pre-conditioning except high temperature storage
  • 85°C/85% RH, 168 hours, IR reflow 260°C 3X
  • H3TRB: 85°C/85% RH, 1000 hours
  • UHAST: 130°C/85% RH, 96 hours
  • Temperature Cycle: -55°C to 150°C, 1000 cycles
  • High Temp Storage: 150°C, 1000 hours

A great solution for the molding compound can be GR 600. Hysol GR600 Series is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of power discrete semiconductor packages, such as DPAK, D2PAK, TO220 and TO251 packages. It has achieved commercial success with many uses on TO applications.


EMC Chemistry

GR600SL2

GR600A

GR600

GR600P1

Platform

TO252/251/263

TO252/251/263

TO252/251/263

TO252/251/263

Resin Type

EOCN + LWA-3

LWA-1 + LWA-2

LWA-1

MAR + Flexible

Hardener Type

PN + LWA-1

LWA-m

LWA-m

--

Filler Loading

85±1%

88±1%

88±1%

88±1%

Filler Type

Spherical + Angular

Spherical

Spherical

-

Catalyst

P/N

P/N

P/N

-

MSL Performance

MSL3

 (Cu/Ag plating)

MSL3 

(Cu/Ag plating)

MSL1 

(Cu/Ag plating)

MSL1 

(Cu/Ag plating)


 

Property / Product

Unit of Measure

GR600 SL2

GR600 A

GR600

GR600 P1

 

UNCURED PROPERTIES

 

         

Hot Plate Gel time,  @ 175°C

s

25

41

28

38

 

Spiral Flow @ 175°C

in

32

53

32

25

 

Flammability

 

1/8’’ V-0

1/8’’ V-0

1/8’’ V-0

1/8’’ V-0

UL94 V-0

Halogen-free (Green)

 

Green product

TYPICAL CURED PROPERTIES

 

         

Specific Gravity, g/cc

g/cc

2.03

1.97

2.00

2.11

 

Glass Transition Temperature, TMA

°C

153

113

122

124

 

Coefficient of Thermal Expansion (CTE)
    Alpha1
    Alpha2


ppm/C
ppm/C


10
43


9.8

28


6.8

26


14

36

Low CTE

Viscosity, @175°C

Pa.s

TBD

14

25

29

 

Flexural Strength, @25°C

MPa

138

139

139

142

 

Flexural Modulus, @25°C

GPa

19.1

19.8

17.6

19.8

Low stress

Storage Modulus (DMA), @25°C

Gpa

26.1

24.7

27.0

25.8

 

Storage Modulus (DMA), @175°C

Mpa

2798

736

1273

1312

 

Storage Modulus (DMA), @260°C

MPa

923

599

897

863

 

Shore-D Hardness @ 90s, 175°C

-

84

75

83

80

 

Moisture Absorption, 24hr PCT

%

0.25

0.25

0.18

0.22

Low water absorption

 

TO-220 is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. 

TO-257 is a hermetically sealed metal package that is otherwise considered equivalent to TO-220.


Silicone Carbide TO packages

TIMS are not the only product category that has to be "custom made" for Power modules. High power requires not just dissipation but also thermally stable semiconductor materials that can withstand the rigourous thermal cycling requirements. These range from die attach, encapsulants and bonding wires to epoxy molding compounds.

Epoxy molding compounds such as the GR750 series and GR15F-MOD2C are made with power modules in mind. With exquisite thermal performance these compounds have a very high Glass transition temperature and easy pass HTRB tests while keeping high MSL levels. They are designed for high power devices with low moisture absorption requirements.

Epoxy Molding compounds application considerations:

  • Excellent Thermal Stability Pass thermal cycling test
    • High Tg as required
    • Low weight loss by TGA test and low thermal expansion
  • Excellent Electrical Stability  Pass HTRB test
    • Low ion content and low ionic mobility at high power condition
    • Stable ionic conductivity and permittivity at high temperature condition;
  • Reliability for SiC MOSFETs Packages Pass MSL test
    • Low moisture absorption 
    • Low storage modulus
    • Superior adhesion to lead frame
    • Low Coefficient of Thermal Expansion (CTE)
  • Environmentally Friendly
    • Green material without Br/Sb comply with RoHS;
    • Suitable for halogen-free devices defined by the Jedec JS709B;


 



Epoxy Molding compounds for TO through hole devices

 

Package: TO92/TO126F
Non-Green Green Key feature
Hysol KL 1000-3HL Hysol KL-G200
Superior moldability; Lower cost
Hysol MG 20KF Hysol GR 260-SL
Good delam &electrical performance
Hysol KL 1000-T
No void; Better operability; High Electrical
Hysol GR 30HT
HTRB / TCT/Good Ni adhesion

 

Package: TO220/247/3P
Non-Green Green Key feature
Hysol KL 1000-TH
High adhesion; High reliability
Hysol KL 1000-3HL
- High adhesion; High reliability
Hysol MG 20KF Hysol GR 260-SL(IMP3)
Lower cost; HAST 96h; HTRB 1000h; -TC500
Hysol MG 15F-35A
Hysol MG 15F-0140
Hysol MG 15F-MOD2C
Suit to high voltage application
Hysol GR 300
HTRB 1000h; Excellent delamination on Ni-plating devices
Hysol GR15F-A
good moisture resistance,Excellent electrical performances, good adhesion to Cu/Ag/Ni., high thermal stability
Hysol GR 30
HTRB / TCT/Good Ni adhesion
Hysol GR 30HT
Fast cure; Good Ni adhesion
Hysol GR 400
Better operability; High Electrical
Hysol GR750
High Glass Transition Temperature, low moisture absorption, designed for high power SiC devices
Hysol GR750 X1/X2
High Glass Transition Temperature, low moisture absorption, designed for high power SiC devices
Hysol GR700 C4/P2
Low stress; Low moisture absorption; High reliability,designed for high power SiC devices

 

 

Package: TO 220F/3PF/126F
Non Green Green
Key feature
Hysol KL 5000HT Hysol KL-G500HT
High thermal conductivity. (.2.0w/m.k, 0.3mm gap)
  Hysol KL-G 500HT-ST
Fast cure/High TC/Excelletn WS control on Cu wire/PCT / HTRB / TCT
Hysol MG 50HT Hysol GR 50HT
High thermal conductivity; Good electrical and delam performance (.2.0w/m.k, 0.3mm gap);HAST 96h; HTRB 1000h; TC1000c; Isolation test DC 4500V; Good workability
  Hysol GR 50HT -ST
PCT 168h; TC1000c; HTRB1000h; Auto mold with Ni-plating lead

 

Epoxy Molding Compounds for TO Surface mount devices

 

Package: D2PAK (TO263)
Product Key Feature
Hysol KL-G680H
MSL1 for Ni-plating lead; HTRB1000h; TC500c
Hysol GR 300
HTRB 1000h; Excellent delamination on Ni-plating devices
Hysol GR 600A
Ag/Cu plating lead & MSL3; Low moisture absorption; Excellent electrical performances
Hysol GR 600-SL
Achieve JEDEC Level 3 on bare copper and nikel plated DPAK/D(2)PAK ; HTRB1000h; HAST96h
Hysol GR 600
Achieve JEDEC Level 1 on bare copper and nikel plated DPAK/D(2)PAK ; Excellent electrical performances
Hysol GR 710
Up to MSL3; Excellent electrical performances; HTRB1000h;
Hysol GR 700
MSL1, excellent electrical performances;designed for high power SiC devices
Hysol GR 750 X2
MSL1, excellent electrical performances;designed for high power SiC devices




 
 

GR60HT

GR60PT

GR50HT

KL G500HT-ST

KL5000HT

GR760HT

GR770HT

Application

Power module

TO(Fullpack)

Under development

Leadframe Type

Cu,Ni,Ag

Cu,Ag

Cu/Ag

Cu/Ag

 Cu/Ag

Cu, Ag, Ni

Cu, Ag, Ni

Filler Type

/

Silica

Silica

Silica

Silica

Silica

Silica/Alumina

Alumina

Filler shape

/

Angular

Angular

Angular

Angular

Angular

Angular/Spherical

Spherical

Filler Cut size

μm

150

150

150

175

150

150

75

Epoxy resin

/

EOCN+α1

EOCN/α2

EOCN+α1

EOCN+α1

EOCN+α1

EOCN+α1

EOCN+α1

Hardener

/

LWA

PN

PN

PN

PN

LWA

LWA

Flammability @ 1/8"

V-0 

V-0 

V-0 

V-0 

V-0 

V-0 

V-0 

Spiral Flow @175°C

cm

58

89

46

41

51

51

64

Gel time(s) @175°C

S

35

34

30

23

20

40

30

Hot Hardness @175°C90S

/

80

80

73

80

84

80

74

CTE1

*E-5/℃

19

20

20

20

21

18

11

CTE2

*E-5/℃

44

60

62

66

61

44

27

Tg

119

165

170

155

175

133

111

Flexural strength

N/mm2

137

120

118

139

115

119

126

Flexural modulus

N/mm2

19625

18000

15125

14475

13330

18847

23532

Water absorption 

( Boiling, 24hrs)

%

0.2

0.3

0.36

0.37

0.29

0.2

0.16

Thermal Conductivity

W/mK

2.2

1.8

2.0

1.8

1.9

3.0

4.8