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Transistors

Transistors

MOSFETS, TOS and BJTS

Switches and Amplifiers

Transistor Outline (TO)

TO-252, also known as DPAK, is a semiconductor package developed for surface mounting on circuit boards. It represents a surface-mount variant of TO-251 package, and smaller variant of the D2PAK package, also known as TO-263. DPAK is suitable for medium-power applications (reference values 80W*/60A), while D2PAK is for higher power application (reference values 100A).
A common Bill Of Materials would include a Ni plated copper leadframe, Pb solder die attach, Al wire for the intereconnects and a molding compound to keep it all together.


Typical Applications

The DPAK/D2PAK package is suitable for medium/high power applications designed for low on-resistance and high-speed switching MOSFETs, such as:

  • motor drivers
  • power supply circuits
  • DC-DC converters,
  • consumer and automotive products.

Typical Reliability test

  • JEDEC standard pre-conditioning except high temperature storage
  • 85°C/85% RH, 168 hours, IR reflow 260°C 3X
  • H3TRB: 85°C/85% RH, 1000 hours
  • UHAST: 130°C/85% RH, 96 hours
  • Temperature Cycle: -55°C to 150°C, 1000 cycles
  • High Temp Storage: 150°C, 1000 hours

A great solution for the molding compound can be GR 600. Hysol GR600 Series is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of power discrete semiconductor packages, such as DPAK, D2PAK, TO220 and TO251 packages. It has achieved commercial success with many uses on TO applications.


EMC Chemistry

GR600SL2

GR600A

GR600

GR600P1

Platform

TO252/251/263

TO252/251/263

TO252/251/263

TO252/251/263

Resin Type

EOCN + LWA-3

LWA-1 + LWA-2

LWA-1

MAR + Flexible

Hardener Type

PN + LWA-1

LWA-m

LWA-m

--

Filler Loading

85±1%

88±1%

88±1%

88±1%

Filler Type

Spherical + Angular

Spherical

Spherical

-

Catalyst

P/N

P/N

P/N

-

MSL Performance

MSL3

 (Cu/Ag plating)

MSL3 

(Cu/Ag plating)

MSL1 

(Cu/Ag plating)

MSL1 

(Cu/Ag plating)


 

Property / Product

Unit of Measure

GR600 SL2

GR600 A

GR600

GR600 P1

 

UNCURED PROPERTIES

 

         

Hot Plate Gel time,  @ 175°C

s

25

41

28

38

 

Spiral Flow @ 175°C

in

32

53

32

25

 

Flammability

 

1/8’’ V-0

1/8’’ V-0

1/8’’ V-0

1/8’’ V-0

UL94 V-0

Halogen-free (Green)

 

Green product

TYPICAL CURED PROPERTIES

 

         

Specific Gravity, g/cc

g/cc

2.03

1.97

2.00

2.11

 

Glass Transition Temperature, TMA

°C

153

113

122

124

 

Coefficient of Thermal Expansion (CTE)
    Alpha1
    Alpha2


ppm/C
ppm/C


10
43


9.8

28


6.8

26


14

36

Low CTE

Viscosity, @175°C

Pa.s

TBD

14

25

29

 

Flexural Strength, @25°C

MPa

138

139

139

142

 

Flexural Modulus, @25°C

GPa

19.1

19.8

17.6

19.8

Low stress

Storage Modulus (DMA), @25°C

Gpa

26.1

24.7

27.0

25.8

 

Storage Modulus (DMA), @175°C

Mpa

2798

736

1273

1312

 

Storage Modulus (DMA), @260°C

MPa

923

599

897

863

 

Shore-D Hardness @ 90s, 175°C

-

84

75

83

80

 

Moisture Absorption, 24hr PCT

%

0.25

0.25

0.18

0.22

Low water absorption

 

TO-220 is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. 

TO-257 is a hermetically sealed metal package that is otherwise considered equivalent to TO-220.


Epoxy Molding compounds for TO through hole devices

 

Package: TO92/TO126F
Non-Green Green Key feature
Hysol KL 1000-3HL Hysol KL-G200
Superior moldability; Lower cost
Hysol MG 20KF Hysol GR 260-SL
Good delam &electrical performance
Hysol KL 1000-T
No void; Better operability; High Electrical
Hysol GR 30HT
HTRB / TCT/Good Ni adhesion

 

Package: TO220/247/3P
Non-Green Green Key feature
Hysol KL 1000-TH
High adhesion; High reliability
Hysol KL 1000-3HL
- High adhesion; High reliability
Hysol MG 20KF Hysol GR 260-SL(IMP3)
Lower cost; HAST 96h; HTRB 1000h; -TC500
Hysol MG 15F-35A
Hysol MG 15F-0140
Hysol MG 15F-MOD2C
Suit to high voltage application
Hysol GR 300
HTRB 1000h; Excellent delamination on Ni-plating devices
Hysol GR15F-A
good moisture resistance,Excellent electrical performances, good adhesion to Cu/Ag/Ni., high thermal stability
Hysol GR 30
HTRB / TCT/Good Ni adhesion
Hysol GR 30HT
Fast cure; Good Ni adhesion
Hysol GR 400
Better operability; High Electrical
Hysol GR750
High Glass Transition Temperature, low moisture absorption, designed for high power SiC devices
Hysol GR750 X1/X2
High Glass Transition Temperature, low moisture absorption, designed for high power SiC devices
Hysol GR700 C4/P2
Low stress; Low moisture absorption; High reliability,designed for high power SiC devices

 

 

Package: TO 220F/3PF/126F
Non Green Green
Key feature
Hysol KL 5000HT Hysol KL-G500HT
High thermal conductivity. (.2.0w/m.k, 0.3mm gap)
  Hysol KL-G 500HT-ST
Fast cure/High TC/Excelletn WS control on Cu wire/PCT / HTRB / TCT
Hysol MG 50HT Hysol GR 50HT
High thermal conductivity; Good electrical and delam performance (.2.0w/m.k, 0.3mm gap);HAST 96h; HTRB 1000h; TC1000c; Isolation test DC 4500V; Good workability
  Hysol GR 50HT -ST
PCT 168h; TC1000c; HTRB1000h; Auto mold with Ni-plating lead

 

Epoxy Molding Compounds for TO Surface mount devices

 

Package: D2PAK (TO263)
Product Key Feature
Hysol KL-G680H
MSL1 for Ni-plating lead; HTRB1000h; TC500c
Hysol GR 300
HTRB 1000h; Excellent delamination on Ni-plating devices
Hysol GR 600A
Ag/Cu plating lead & MSL3; Low moisture absorption; Excellent electrical performances
Hysol GR 600-SL
Achieve JEDEC Level 3 on bare copper and nikel plated DPAK/D(2)PAK ; HTRB1000h; HAST96h
Hysol GR 600
Achieve JEDEC Level 1 on bare copper and nikel plated DPAK/D(2)PAK ; Excellent electrical performances
Hysol GR 710
Up to MSL3; Excellent electrical performances; HTRB1000h;
Hysol GR 700
MSL1, excellent electrical performances;designed for high power SiC devices
Hysol GR 750 X2
MSL1, excellent electrical performances;designed for high power SiC devices