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Transistors

Transistors

MOSFETS, TOS and BJTS

Switches and Amplifiers
Transistor Outline (TO)

Transistor Outline (TO)

TO-220 is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. 

TO-257 is a hermetically sealed metal package that is otherwise considered equivalent to TO-220

 

Epoxy Molding compounds for TO through hole devices

 

Package: TO92/TO126F
Non-Green Green Key feature
Hysol KL 1000-3HL Hysol KL-G200
Superior moldability; Lower cost
Hysol MG 20KF Hysol GR 260-SL
Good delam &electrical performance
Hysol KL 1000-T
No void; Better operability; High Electrical
Hysol GR 30HT
HTRB / TCT/Good Ni adhesion

 

Package: TO220/247/3P
Non-Green Green Key feature
Hysol KL 1000-TH
High adhesion; High reliability
Hysol KL 1000-3HL
- High adhesion; High reliability
Hysol MG 20KF Hysol GR 260-SL(IMP3)
Lower cost; HAST 96h; HTRB 1000h; -TC500
Hysol MG 15F-35A
Hysol MG 15F-0140
Hysol MG 15F-MOD2C
Suit to high voltage application
Hysol GR 300
HTRB 1000h; Excellent delamination on Ni-plating devices
Hysol GR15F-A
good moisture resistance,Excellent electrical performances, good adhesion to Cu/Ag/Ni., high thermal stability
Hysol GR 30
HTRB / TCT/Good Ni adhesion
Hysol GR 30HT
Fast cure; Good Ni adhesion
Hysol GR 400
Better operability; High Electrical
Hysol GR750
High Glass Transition Temperature, low moisture absorption, designed for high power SiC devices
Hysol GR750 X1/X2
High Glass Transition Temperature, low moisture absorption, designed for high power SiC devices
Hysol GR700 C4/P2
Low stress; Low moisture absorption; High reliability,designed for high power SiC devices

 

 

Package: TO 220F/3PF/126F
Non Green Green
Key feature
Hysol KL 5000HT Hysol KL-G500HT
High thermal conductivity. (.2.0w/m.k, 0.3mm gap)
  Hysol KL-G 500HT-ST
Fast cure/High TC/Excelletn WS control on Cu wire/PCT / HTRB / TCT
Hysol MG 50HT Hysol GR 50HT
High thermal conductivity; Good electrical and delam performance (.2.0w/m.k, 0.3mm gap);HAST 96h; HTRB 1000h; TC1000c; Isolation test DC 4500V; Good workability
  Hysol GR 50HT -ST
PCT 168h; TC1000c; HTRB1000h; Auto mold with Ni-plating lead

 

Epoxy Molding Compounds for TO Surface mount devices

 

Package: D2PAK (TO263)
Product Key Feature
Hysol KL-G680H
MSL1 for Ni-plating lead; HTRB1000h; TC500c
Hysol GR 300
HTRB 1000h; Excellent delamination on Ni-plating devices
Hysol GR 600A
Ag/Cu plating lead & MSL3; Low moisture absorption; Excellent electrical performances
Hysol GR 600-SL
Achieve JEDEC Level 3 on bare copper and nikel plated DPAK/D(2)PAK ; HTRB1000h; HAST96h
Hysol GR 600
Achieve JEDEC Level 1 on bare copper and nikel plated DPAK/D(2)PAK ; Excellent electrical performances
Hysol GR 710
Up to MSL3; Excellent electrical performances; HTRB1000h;
Hysol GR 700
MSL1, excellent electrical performances;designed for high power SiC devices
Hysol GR 750 X2
MSL1, excellent electrical performances;designed for high power SiC devices