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Smartcard Materials

Glass-epoxy, die-attach and UV & heat-cure encapsulant materials that work great together.

Available online via CAPLINQ.com
Smartcard AssemblyJunction Coating ResinsPassive ElectronicsLED AssemblySemiconductor Assembly

Smartcard Assembly Materials

Die Attach, Glass-Epoxy Substrates and UV Dam and Fill and Glob Top Encapsulants for Smartcards

CAPLINQ supplies a range of materials for Smartcard assembly.

UV Dam and Fill Encapsulants for Smartcards Anti-Static Plastic Reels for Smartcards Non-conductive Die Attach for Smartcards

Please contact us for more information on these products.