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Soldering Materials

Lead-free and Tin-Lead Solder Spheres in sizes ranging from 60µm-890µm (2.4 - 35mil)

Purchase directly from CAPLINQ.com

Bismuth-Tin Pb-free Spheres

Low-Melting-Temperature, Lead-Free, Eutectic & Near-Eutectic Solder Spheres for heat-sensitive applications

Purchase directly from CAPLINQ.com

Soldering Materials

Tin-Lead and Lead-Free Solder Spheres

CAPLINQ is proud to offer the highest quality solder spheres at some of the markets' best prices. Be sure to read this article to find out makes our high quality solder spheres so great. CAPLINQ offers not only a broad range of tin/lead and leadfree solder spheres, but also offers the industry's widest range of solder ball diameters ranging from 60 micron to 890 micron (2.4 mil to 35 mil).

Pb-Free Spheres SAC105, SAC125N SAC305, SAC387, SAC396, SAC405, SnAg or another alloy?

After many years of testing and debating, and with specific exceptions, the semiconductor industry has largely settled on the use of Tin (Sn), Silver(Ag), Copper(Cu) - or SAC - alloy for the assembly of lead free products. Although the SAC alloy has been settled, which SAC alloy to use is still up for debate. North American and Europe manufacturers favor SAC305 (Sn3.0Ag0.5Cu), while Asian manufacturers generally favor SAC405 (Sn3.8Ag0.8Cu).

SAC305 was first developed by Senju technology, who own the patents herefore. As such, manufacturers are required to pay a license to produce SAC305 which is built into the price charged to customers. SAC305 however has the benefit of being less expensive to produce than SAC405 owing to the lower silver content. This said, studies indicate that there is no significant reliability difference between SAC305 and SAC405, and so CAPLINQ continue to support both SAC305 and SAC405.

High Tech Tin

CAPLINQ is not only able to supply the alloys and purify the solder material, but it has an innovative diameter and spheroid selecting system of solder balls and an advanced anti-oxidation technology that actually dopes an anti-oxidation element into the alloy in addition to its OSP surface coating process.

Not only are our solder spheres High-Tech, but they are made from a unique uniform droplet spraying technology that far outperforms competitors in terms of productivity. This combination of high technology and high productivity allow CAPLINQ to offer its customers the best value for the best product.

Low volume flexibility, high volume pricing

CAPLINQ maintains an inventory of many sphere alloys and sizes, and we specialize in the fulfillment of small orders. CAPLINQ also offers volume breaks and discounts for our higher volume customers. A complete list of sphere diameters, packaging quantities, volume breaks and discounts can be seen by clicking on the product Alloy Type below.

Learn More

Solder Sphere Selector Guide
% Metal LoadingMelting TemperatureRemarks
Top of Page
Product Overview of Tin-Lead and Pb-free Solder Spheres
Available from Caplinq Corporation
Tin/Lead (Sn63Pb37) Solder Spheres Tin-Lead 63 37 - - - 183 - - Eutectic Tin-Lead
SAC105 Lead-Free Solder Spheres Pb-free 98.5 - - 1.0 0.5 - 220 225 Lowest Silver Content
SAC125N Lead-Free Solder Spheres Pb-free 98.3 - - 1.2 0.5 - 217 219 0.05% Nickel (Also called SAC125Ni)
SAC305 Lead-Free Solder Spheres Pb-free 96.5 - - 3.0 0.5 - 217 221 Industry Standard Pb-free
SAC387 Lead-Free Solder Spheres Pb-free 95.5 - - 3.8 0.7 - 217 219 Special Application Pb-free
SAC396 Lead-Free Solder Spheres Pb-free 95.5 - - 3.9 0.6 - 217 221 Industry Standard Pb-free
SAC405 Lead-Free Solder Spheres Pb-free 95.5 - - 4.0 0.5 - 217 225 Highest Silver Content
Sn96.5Ag3.5 Lead-Free Solder Spheres Pb-free 96.5 - - 3.5 - 221 - - Eutectic Leadfree High Silver Sn96.5Ag3.5
Sn100 Lead-Free Solder Spheres Pb-free 99.9928% min - - - - 232 - - 4N Pure Tin (>99.9928% Sn)
Bi58Sn42 Lead-Free Solder Spheres Pb-free 42 - 58 - - 138 - - Eutectic Low-Temperature Bismuth-Tin Bi58Sn42
Bi57Sn42Ag1 Lead-Free Solder Spheres Pb-free 42 - 57 1.0 - - 139 140 Near-Eutectic Low-Temperature Bismuth-Tin Bi57Sn42Ag1
Solder Powder Particle Sizes
Powder Description Description Particle size
Type 3 AGS 20 - 45
Type 4 DAP 25 - 38
Type 4.5 (4A) DAP+ 20 - 32
Type 5 KBP 10 - 25
Solder Flux Classification
Flux ingredient Flux activity Halide content (% by weight) Classification Flux designator
Rosin (RO) Low 0 LO ROLO
Rosin (RO) Low <0.5 L1 ROL1
Rosin (RO) Moderate 0 MO ROMO
Rosin (RO) Moderate 0.5-2.0 M1 ROHO
Rosin (RO) High 0 HO ROHO
Rosin (RO) High >2.0 H1 ROH1
Solder Alloy Properties
Henkel code Alloy Melting point (°C) Density point (g/cm3) Electrical resistivity Thermal conductivity (W/m-K)
2.5S Pb92.5/Sn05/Ag2.5 287-296 11.02 0.2 44
90iSC (High-Reliability) SAC387/Bi3/Sb1.5/Ni0.02 209-217 7.38 0.132 58
92A Sn91.5/Sb8.5 235-243 7.25 0.145 28
95A Sn95/Sb5 236-240 7.25 0.145 28
96S Sn96.5/Ag3.5 221 7.37 0.123 55
SAC0307 Sn99/0.7Cu/0.3Ag 217-228 7.33 0.15 64
SAC305* SAC305 or Sn96.5/Ag3.0/Cu0.5 217 7.338 0.132 58
SAC387** SAC387 or Sn95.5/Ag3.8/Cu0.7 217 7.44 0.132 60

View Technical Papers and Brochures

Solder Sphere Technical Papers, Solder Sphere Marketing Brochures, Solder Spheres Technical Data Sheets, Solder Sphere MSDS. If these are what you are looking for, then this is where you should be.

Read our Blog on Solder Spheres

Everyday, people just like you have questions about solder spheres. At CAPLINQ, we try to help people just like you by blogging about solder spheres. From solder sphere pricing to harmonization codes to product part numbers and leadtimes. We try to post as much information as we can on our blogs, to help you find more relevant information about solder spheres.