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Soldering Materials

Lead-free and Tin-Lead Soldering materials

Available directly at CAPLINQ.com

Soldering Materials

Soldering materials cover a wide range of products such as solder spheres in jar or solder spheres on tape and reel, bonding wires, solder pastes, solder bar ans solder powders. We offer a wide range of alloys at some of the markets' best prices. Be sure to read this article to find out makes our high quality solder spheres so great. We offer not only a broad range of tin/lead and leadfree solder materials, but also offer the industry's widest range of solder ball diameters ranging from 60 micron to 890 micron (2.4 mil to 35 mil).

In addition to supplying the alloys and purifying the soldering material, we have an innovative diameter and spheroid selecting system of solder balls and an advanced anti-oxidation technology that actually dopes an anti-oxidation element into the alloy in addition to its OSP surface coating process. Not only are our solder spheres High-Tech, but they are made from a unique uniform droplet spraying technology that far outperforms competitors in terms of productivity. This combination of high technology and high productivity allow CAPLINQ to offer its customers the best value for the best product.

CAPLINQ maintains an inventory of many soldering material alloys and sizes, and we specialize in the fulfillment of small orders. This allows us to have low volume flexibility and also offer volume breaks and discounts for our higher volume customers. A complete list of sphere diameters, packaging quantities, volume breaks and discounts can be seen in the respective product categories. Can't find what you are looking for? Contact us for more information.

Frequently Asked Questions

Pb-Free Spheres SAC105, SAC125N SAC305, SAC387, SAC396, SAC405, SnAg or another alloy?

After many years of testing and debating, and with specific exceptions, the semiconductor industry has largely settled on the use of Tin (Sn), Silver(Ag), Copper(Cu) - or SAC - alloy for the assembly of lead free products.

Although the SAC alloy has been settled, which SAC alloy to use is still up for debate. North American and Europe manufacturers favor SAC305 (Sn3.0Ag0.5Cu), while Asian manufacturers generally favor SAC405 (Sn3.8Ag0.8Cu).

What is the SAC alloy history?

SAC305 was first developed by Senju technology, who own the patents herefore. As such, manufacturers are required to pay a license to produce SAC305 which is built into the price charged to customers. SAC305 however has the benefit of being less expensive to produce than SAC405 owing to the lower silver content.

Having said that, studies indicate that there is no significant reliability difference between SAC305 and SAC405, and so CAPLINQ continue to support both SAC305 and SAC405.

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Solder Powder Particle Sizes
Powder Description Description Particle size
Type 3 AGS 20 - 45
Type 4 DAP 25 - 38
Type 4.5 (4A) DAP+ 20 - 32
Type 5 KBP 10 - 25


Solder Flux Classification
Flux ingredient Flux activity Halide content (% by weight) Classification Flux designator
Rosin (RO) Low 0 LO ROLO
Rosin (RO) Low <0.5 L1 ROL1
Rosin (RO) Moderate 0 MO ROMO
Rosin (RO) Moderate 0.5-2.0 M1 ROHO
Rosin (RO) High 0 HO ROHO
Rosin (RO) High >2.0 H1 ROH1


Solder Alloy Properties
Code Alloy Melting point (°C) Density point (g/cm3) Electrical resistivity Thermal conductivity (W/m-K)
2.5S Pb92.5/Sn05/Ag2.5 287-296 11.02 0.2 44
90iSC (High-Reliability) SAC387/Bi3/Sb1.5/Ni0.02 209-217 7.38 0.132 58
92A Sn91.5/Sb8.5 235-243 7.25 0.145 28
95A Sn95/Sb5 236-240 7.25 0.145 28
96S Sn96.5/Ag3.5 221 7.37 0.123 55
SAC0307 Sn99/0.7Cu/0.3Ag 217-228 7.33 0.15 64
SAC305* SAC305 or Sn96.5/Ag3.0/Cu0.5 217 7.338 0.132 58
SAC387** SAC387 or Sn95.5/Ag3.8/Cu0.7 217 7.44 0.132 60