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Thermal Interface Materials are used to dissipate heat as quickly and effectively as possible from the device. But not all devices are the same. Requirements are driven by product use, product life cycle, packaging design, and operating conditions. Smartphones and tablets experience sudden temperature spikes, requiring very high thermal performance, while power electronics in automobiles need extreme thermal stability to meet warranties that stretch over long lifetimes.
That’s why our products optimize thermal impedance. This means that we look at the entire thermal path, not just the thermal interface material itself. This includes the material interfaces, the thermal expansion of the joining interfaces, contact resistance and bond line thicknesses. Our portfolio of materials dissipate heat away from the IC, in an appropriate way for the device structure, packaging design and application. The design of Honeywell’s portfolio of phase change materials (PCMs) is driven by an innovative polymer technology and advanced filler system, which can be customized to fit diverse product applications and end uses.
In addition to our phase change materials, we offer a variety of products with high thermal conductivity and high compressibility, including thermal gap pads, Thermal Hybrid, thermal grease, thermal insulators, and more.
The modern electronics industry is constantly advancing toward higher power consumption and more integrated functions and miniaturization, resulting in a sharp increase in the power density of modern electronic devices. In fact, we have entered the era of 5G.
Therefore, efficient heat dissipation has become an even more critical requirement for the design of modern electronic packages. Thermal interface materials (TIMs) are widely employed to manufacture the most critical parts in the heat dissipation system, to cool and protect integrated circuit (IC) chips.
Honeywell TIMs are based on proprietary technologies of polymer matrices and thermally conductive fillers, enabling them to handle challenging heat dissipation issues with long-term reliability and low cost of ownership.
Increasing power densities are raising device temperatures — requiring more effective TIM solutions that must deliver low thermal impedance and high bulk conductivity. Reducing operating temperature can reduce device throttling, while increasing efficiency and design flexibility.
Mobile products such as tablets and smartphones have a relatively short product life, but still require thermal management to protect from extreme and sudden bursts of energy and temperature spikes. Conversely, automotive, power and server products must remain robust for significantly longer product life cycles. These applications involve harsh operating conditions such as extreme heat and humidity, which must be taken into account in choosing the best TIM material. The key requirement in these applications is not just immediate performance but also sustained, long-term thermal stability
IC designers are continually looking for ways to achieve more processing power in less space. Additionally, high power devices with dedicated heat sinks aim to achieve an extremely thin TIM bond line with low thermal impedance and a reduced thermal path. To add to the complexity, chip-scale packages assembled on a PC board will share the same heat spreader but will have different heights with varying gaps, requiring a TIM that delivers both thermal and compressible properties. Taking all this into consideration, it is important for today’s TIMs to provide effective thermal management in increasingly constrained environments and different assembly designs.