Shin-Etsu SFX-513S, SFX-524A and SFX-526A are Wafer Backside Coating (WBC) Options for same-size die stacking.

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Same size die stacking is different from other die stacking in that the bondline thickness must be a minimum of 60µm – 80µm high to ensure enough wirebond-loop height. In short, there are four proven ways to achieve this: Dummy-Die silicon interposer (a space-consuming, expensive and redundant method not discussed here as it is a [...]

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Have you ever wondered how you can best and most affordably EMF (electro-magnetic field) shield a room in your house? With LINQSTAT VCF (Volume Conductive Film) of course. A direct equivalent to 3M Velostat (read the article on generic brands here), Linqstat VCF is a very low cost (up to 50% cheaper than 3M Velostat), [...]

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