Mold release sprays are semiconductor mold maintenance products that are used in between transfer or compression molding shots to make sure that molded devices will “pop-off”” easily after cure. They […]
Liquid encapsulants and Epoxy molding compounds are generally two sides of the same coin. But what sets them apart? Find out in this blog.
Machine and Transverse directions are two crucial tape properties that define the orientation of their measured specifications.
I am happy to announce that as of September 6th, 2021, Elisabetta Cesaroni has joined CAPLINQ as Customer Service & Order Process Administrator. Working out of our offices in Assendelft, the […]
I am happy to announce that as of August 16th, 2021, Natalja Vasseur has joined CAPLINQ as Quality, Health, Safety & Environment (QHSE) Administrator. Working out of our offices in Assendelft, […]
Curing die attach pastes in a vacuum is not a great idea after all. Evaporation, lack of heat uniformity and contamination are to blame.
I am happy to announce that as of September 4th, 2021, Garrett Schrum celebrated his 9 months anniversary with CAPLINQ Americas as Sales Engineer. Working out of our offices in Livonia, […]
Die attach films enable very thin dies, eliminate fillets and achieve uniform bondline thickness. This aids miniaturising and 2.5D and 3D die stacking.
