Recently, a customer complained that he had a hard time correlating the wire bond sweep with material properties like spiral flow, filler content, filler size, etc. He was using mold flow analysis […]
My name is Kim van Leeuwen and I am a sales intern at Caplinq Europe. I am studying Junior account management and International Vocational Studies (IVS) at Nova College. In this blog, I am […]
By definition, the glass transition temperature (Tg) of an epoxy molding compound (EMC) is the temperature at which the EMC changes from a hard, glassy substance to a soft rubbery one. Physical […]
Yesterday, EFT announced the sale of Spectracarb, their graphitized carbon paper business to Giner ELX. Below is the press release that gives all details of the sale. Included in the […]
A customer recently asked us, “I have UK-based customers, what are the consequences of Brexit for my REACH registrations?” This is a very good question indeed, for which we can offer the […]
Epoxy Mold Compound Articles
In the second half of August of 2018, Samsung SDI announced that it was exiting the epoxy molding compound for power discrete semiconductor packages. With almost a 4% market share of […]
In a previous article, we talked about how epoxy molding compound pellets have specific aspect ratios. In this article, we will explain in more detail how epoxy molding compounds pellets have […]
I am happy to announce that Mark Hoebeke has joined CAPLINQ EUROPE as our Senior Technical Lead, and will be working out of our Heemskerk office in the Netherlands. Mark […]
