Curing die attach pastes in a vacuum is not a great idea after all. Evaporation, lack of heat uniformity and contamination are to blame.
I am happy to announce that as of September 4th, 2021, Garrett Schrum celebrated his 9 months anniversary with CAPLINQ Americas as Sales Engineer. Working out of our offices in Livonia, […]
Die attach films enable very thin dies, eliminate fillets and achieve uniform bondline thickness. This aids miniaturising and 2.5D and 3D die stacking.
If you have been paying attention to the product developments over the last few years, reworkable underfills are gaining more and more traction over non reworkable ones. Without thinking about it […]
Package level EMI shielding reduces the dimensions and weight of the overall design and provides a compact and effective shielding method.
What are Phase change materials? Phase change materials (PCM) are silicone free pads and stencil printable pastes that are typically used as matrix materials for thermal interface applications. The magic […]
Identifying resin bleed, separation and outgassing causes and troubleshooting the process, equipment and materials to reduce or eliminate it.
I am happy to announce that effective November 9th, 2020, Donovan Cerneüs has joined CAPLINQ as Technical Service Representative. Donovan will be working full-time out of our new offices in […]