| Tag Name | Description |
|---|
| 100 micron @100°C | |
| 25 micron @100°C | |
| 2x2mm @25°C | |
| 2x2mm @260°C | |
| 3x3mm @25°C | |
| 3x3mm @260°C | |
| 5% Weight Loss Temperature | |
| 50 micron @100°C | |
| Adhesion Strength | Adhesion is the bond strength measurement of a coating to a substrate. When an adhesive is bonded to an item or surface, numerous physical, mechanical and chemical forces come into play, which may have an effect on each other. |
| Adhesive Layer | A layer that is applied to one surface or both to bind items together and resist their separation |
| Adhesive Thickness | Adhesive thickness indicates the thickness of an adhesive layer. It refers to the adhesive thickness of a single side so for double sided tapes it always needs to be multiplied. |
| Air Permeability | The air permeability of a fabric is a measure of how well it allows the passage of air through it. |
| Alloy Composition | Composition of the alloy material |
| Alloy Type | A metallic element type |
| Aluminum (Al) | Aluminium is a metallic element with a silvery-white, soft nonmagnetic, ductile elements that has a melting point of 660.3 C |
| Antimony (Sb) | Antimony is a lustrous gray metalloid found in batteries, low friction metals, cable sheating and among other products |
| Appearance | Appearance at room temperature. |
| Arc Resistance | ASTM-D495 expresses arc resistance as the number of seconds that a material resists forming a surface-conducting path when exposed to a high-voltage, low-current arc occurring intermittently. Results obtained from a nominal 3 mm thickness are meant to represent the material’s reaction in any thickness. |
| Auto CSV Generation | CSV (comma-separated values) is a simple data file for spreadsheet software. |
| Auto ignition temperature | |
| Auto PDF Generation | PDF (Portable Document Format) will convert a generated document into a pdf file |
| Barcol Hardness (Type 935) | |
| Basis Weight | Basis weight refers to the weight measured in pounds off 500 sheets of paper in that paper’s basic sheet size. |
| Battery Included | |
| Battery Type | Specific types of battery that can vary from Nickel Cadmium, Nickel-Metal Hydride, Lead Acid Battery, Lithium Ion battery and more. |
| Benzene Adsorption | |
| Bismuth (Bi) | Bismuth is a chemical element with symbol Bi and atomic number 83. Bismuth is the most naturally diamagnetic element, and has one of the lowest values of thermal conductivity among metals. |
| Boiling Point | The amount of degree’s needed to reach in order to make the substance boil. |
| Breakdown Voltage | Breakdown voltage is the minimum voltage necessary to force an insulator to conduct some amount of electricity. It is the point at which a material ceases to be an insulator and becomes a resistor that conducts electricity at some proportion of the total current. After dielectric breakdown, the material may or may not behave as an insulator any more because of the molecular structure alteration. The current flow tend to create a localised puncture that totally alters the dielectric properties of the material. This electrical property is thickness dependent and is the maximum amount of voltage that a dielectric material can withstand before breaking down. The breakdown voltage is calculated by multiplying the dielectric strength of the material times the thickness of the film. |
| Bulk Density | The amount of a certain product that comes in a bulk. |
| Certifications | Confirmation of tested functions, characteristics of a product. |
| Chemistry Type | |
| Chloride (Cl-) | The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm) |
| Chromium (Cr) | Chemical element with a steely-grey, hard and brittle metal, resists tarnishing and has a high melting point. |
| Coating Thickness | |
| Coefficient of Thermal Expansion (CTE), α1 | CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg. |
| Coefficient of Thermal Expansion (CTE), α2 | CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg. |
| Color | The color |
| Compression Pressure | |
| Conductivity | |
| Connection Interface | Is an interface between two pieces of equipments that functions such as passing messages, connecting and disconnecting, etc. |
| Continuous Operating Temperature | |
| Copper (Cu) | Copper is a soft malleable and ductile metal with a very high thermal and electrical conductivity. |
| Copper (Cu) | |
| Cure Temperature | |
| Cure Time | |
| Curing | |
| Curing Time @ 150°C / 302°F | |
| Curing Time @ 160°C / 320°F | |
| Curing Time @ 170°C / 338°F | |
| Curing Time @ 175°C / 347°F | |
| Curing Time @ 175°C / 347°F (Automold) | |
| Curing Time @ 175°C / 347°F (Conventional Mold) | |
| Curing Time @ 190°C / 374°F | |
| Curing Time @ 190°C / 374°F (Automold) | |
| Curing Time @ 210°C / 410°F | |
| Cut Through Temperature | the thermal resistance temperature/ durability |
| Data Storage Capacity | The amount of readings that can be stored in the device |
| Decomposition Temperature | |
| Density | Volumetric mass per unit |
| Diameter | |
| Dielectric Constant (IPC-TM-650 2.5.5.9) 1.5 GHz | |
| Dielectric Constant @ 1000 kHz | |
| Dielectric Constant @ 150 ˚C/1 kHz | |
| Dielectric Constant @ 150 ˚C/10 kHz | |
| Dielectric Constant @ 150 ˚C/100 kHz | |
| Dielectric Constant @ 23 ˚C/1 kHz | |
| Dielectric Constant @ 23 ˚C/10 kHz | |
| Dielectric Constant @ 23 ˚C/100 kHz | |
| Dielectric Constant @ 25 ˚C/100 kHz | |
| Dielectric Constant @ 25 ˚C/1000 kHz | |
| Dielectric Strength | Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow. |
| Dissipation Factor (IPC-TM-650 2.5.5.9) 1.5 GHz | |
| Dissipation Factor @ 23°C /1 kHz | |
| Dissipation Factor @ 23°C /10 kHz | |
| Dissipation Factor @ 23°C /100 kHz | |
| Dissipation Factor @ 25°C /100 kHz | |
| Dissipation Factor @ 25°C /1000 kHz | |
| Dissipation Factor @ Imc | |
| Durometer (Shore 00) | |
| Durometer (Shore A) | |
| Durometer (Shore D) | |
| Edge Coverage | |
| Electrical Resistivity | Is an intrinsic property that quantifies how strongly a given material opposes the flow of electric current |
| Elongation | Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break. |
| Eutectic Melting Temperature | Eutectic melting temperature is the precise temperature point at which an alloy turns from pure solid to liquid. Eutectic alloys are unique. They do not have a Solidus / Liquidus melting range but they have a single temperature point at which the alloy immediately becomes liquid and vice versa. |
| Evaporation Rate | |
| Fabric Thickness | Determines the thickness accurately and conveniently of the fabric |
| Filler Content | |
| Filler Size Cut | |
| Film Thickness | Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039. |
| Film Thickness | |
| Flammability | |
| Flash Point | |
| Flash, 0.25mil channel | Flash in millimeters in a 0.25mil deep channel |
| Flash, 0.5mil channel | Flash in millimeters in a 0.5mil deep channel |
| Flash, 1mil channel | Flash in millimeters in a 1mil deep channel |
| Flash, 2mil channel | Flash in millimeters in a 2mil deep channel |
| Flash, 3mil channel | Flash in millimeters in a 3mil deep channel |
| Flexural Modulus @ 21°C | Flexural Modulus taken at 21°C |
| Flexural Modulus @ 220°C | Flexural Modulus taken at 220°C |
| Flexural Modulus @ 25°C | |
| Flexural Modulus @ 260°C | Flexural Modulus taken at 260°C |
| Flexural Strength @ 21°C | |
| Flexural Strength @ 220°C | Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 220°C |
| Flexural Strength @ 240°C | Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 240°C |
| Flexural Strength @ 25°C | Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C |
| Flexural Strength @ 260°C | Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 260°C |
| Flow Rate @ 200°C | |
| Functionality | |
| Gel Time @ 121°C / 250°F | |
| Gel Time @ 160°C / 320°F | |
| Gel Time @ 175°C / 347°F | |
| Gel Time @ 177°C / 351°F | |
| Glass Plate Flow @ 150°C | Glass plate flow determines the flow distance of thermosetting epoxies, resins or coating powders on a smooth inclined glass surface in a certain time and temperature. This value is the distance in millimetres from the upper point of the original position of the pellet to the point of extreme flow. |
| Glass Transition Temperature (Tg) | The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs. |
| Heat Distortion Temperature | The temperaturea t which a polymer or plastic sample deforms under a specified load |
| Heat Seal Pressure | |
| Heat Seal Temperature | |
| Heat Seal Time | |
| Heat Sealable | |
| Hot Hardness, Shore D @ 175°C / 347°F after 90 seconds | |
| Impact Strength | |
| Indium (In) | Indium is a chemical element with the symbol In and atomic number 49. Indium is the softest metal that is not considered to be an alkali metal. It is a silvery-white metal that resembles tin in appearance. |
| Iodine Adsorption | |
| Ion Exchange Capacity (IEC) | Ion-exchange capacity measures the ability of a material to undergo displacement of ions, previously attached into its structure, by oppositely charged ions. It is measured as the quantity of ions that can pass through a specific volume and a common unit is eq/L. In the case of an Ion-exchange polymer, it represents the total of active sites or functional groups responsible for the exchange and is the theoretical maximum amount of ions that we can load. |
| Iron (Fe) | A chemical element with a melting point of 1,538 C |
| Lead (Pb) | |
| Lead (Pb) | |
| Length | |
| Liquidus Melting Temperature | Liquidus, is the temperature point at which an alloy becomes completely liquid. |
| Loss modulus peak @ DMA | |
| Magnesium (Mg) | |
| Melting temperature | |
| Mix Ratio | The amount of a constituent divided by the total amount of all other constituents in a mixture |
| Moisture absorption | |
| Moisture absorption - 168h @ 85ºC | 85% RH | |
| Moisture Absorption - 24h @ 23°C | 50%RH | |
| Moisture absorption - 24h @ PCT | |
| Mold Temperature | |
| Molded Shrinkage | |
| Molecular weight | |
| MSL Level | |
| Nickel (Ni) | |
| Number of Bags | |
| Number of Uses | |
| Oil Contact Angle | The contact angle is the angle, conventionally measure trough the liquid, where a liquid-vapor interface meets a solid surface. |
| Particle Size thru 325 mesh | |
| Particle Size thru 80 mesh | |
| Permittivity | In electromagnetism, the absolute permittivity, often simply called permittivity and denoted by the Greek letter ε, is a measure of the electric polarizability of a dielectric. |
| Permselectivity | Permselectivity is the term used to define the preferential permeation of certain ionic species through ion-exchange membranes. The permselectivity of a membrane is determined by the ratio of the flux of specific components to the total mass flux through the membrane under a given driving force. |
| Porosity | Void fraction is a measure of the void spaces in a material |
| Post curing (minimum) | Process of exposing a part of mold to elevated tempertures to speed up the curing process and to maximize some of the material’s physical properties. |
| Post Mold Cure @ 150°C / 302°F | |
| Post Mold Cure @ 175°C / 347°F | |
| Pot Life | Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure. |
| Potassium (K) | |
| Potassium (K+) | The amount of Potassium (K+) ion extracted from the product in parts per million (ppm) |
| Pre-Heating (optional) | |
| Preheat Temperature | |
| Process Method | |
| Recording Cycle | |
| Recording Interval | |
| Refractive index | The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material. The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters. |
| Release Liner | A paper or plastic-based film sheet used to prevent a sticky surface from prematurely adhering |
| Reprogrammable | |
| RoHS Compliant | RoHS is a product level compliance based on a European Union Directive which restricts the Use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS). Products compliant with this directive do not exceed the allowable amounts of the following restricted materials: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), with some limited exemptions |
| Shear Strength | |
| Shelf Life @ -20°C | |
| Shelf Life @ -4°C | |
| Shelf Life @ -40°C | |
| Shelf Life @ 15°C | |
| Shelf Life @ 25°C | |
| Shelf Life @ 4.5°C | |
| Shelf Life @ 5°C | |
| Shots | |
| Silicon Dioxide(SiO2) | |
| Silver (Ag) | |
| Single or Double-Sided Adhesive | Describes whether a tape is single- or double-sided. If it is single-sided, it has adhesive only on one side of the backing film. If it is double-sided, then it has adhesive on both sides of the backing film. |
| Sodium (Na) | |
| Sodium (Na+) | The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm) |
| Software | |
| Solids | |
| Solidus Melting Temperature | Solidus is the temperature point at which a completely solid alloy starts melting and becoming softer. |
| Special Layer | |
| Special Layer Thickness | |
| Special Properties | |
| Specific Gravity | Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. |
| Specific Gravity 250°C | |
| Specific Heat Capacity | Specific heat capacity is the amount of heat energy required to raise the temperature of a substance per unit of mass. The specific heat capacity of a material is a physical property. It is also an example of an extensive property since its value is proportional to the size of the system being examined. |
| Specific Surface Area (BET) | |
| Spheroid Tolerance | The allowed % that a solder ball (solder sphere) can divert from being perfectly round and spherical. We take one lot of solder spheres and divide it into 4 smaller lots. Each lot is then checked with advanced visual inspection systems. If even 1 ball is out of spec, the entire batch is scrapped and reworked! |
| Spiral Flow @ 175°C | |
| Spiral Flow @ 177°C / 351°F | |
| Startup Mode | |
| Stop Mode | |
| Storage (DMA) Modulus @ -65°C | |
| Storage (DMA) Modulus @ 100°C | |
| Storage (DMA) Modulus @ 175°C | |
| Storage (DMA) Modulus @ 200°C | |
| Storage (DMA) Modulus @ 25°C | |
| Storage (DMA) Modulus @ 260°C | |
| Storage Temperature | |
| Surface Resistivity | |
| System | |
| Tan δ peak @ DMA | |
| Tear Resistance | Tear resistance (or tear strength) is a measure of how well a material can withstand the effects of tearing. |
| Temperature Accuracy | |
| Temperature Range | |
| Temperature Resistance | Temperature resistance is the maximum temperature that the material or product can withstand for a period of time. The temperatures listed should be considered as guidelines for an operating temperature of about 30 minutes. Typically, the material can withstand much longer times at temperatures about 20°C lower and can withstand much higher temperatures for short, intermittent times. |
| Temperature Resolution | |
| Tensile Modulus @ 21°C | |
| Tensile Modulus @-65°C | |
| Tensile Modulus @100°C | |
| Tensile Modulus @150°C | |
| Tensile Modulus @200°C | |
| Tensile Modulus @25°C | |
| Tensile Modulus @250°C | |
| Tensile Modulus @300°C | |
| Tensile Strength | Tensile strength determines the resistance of a material to break under tension and it measures how much elongating load (or tensile stress) it can handle before fracture. To make it simple, it measures how much force we have to apply when pulling apart a material before it breaks. |
| Tensile Strength (Thin Film) | Tensile strength determines the resistance of a material to break under tension and it measures how much elongating load (or tensile stress) it can handle before fracture. To make it simple, it measures how much force we have to apply when pulling apart a material before it breaks. |
| Tensile Strength @ 21°C | |
| Thermal Conductivity | Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. |
| Thermal Impedance | |
| Thickness range | |
| Thixotropic index | Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material. |
| Tin (Sn) | |
| Total Thickness | Total thickness is taking into account all the films, coatings, adhesives, release liners and special layers and is the maximum thickness of a film or tape. |
| Transfer Pressure | |
| Transfer Pressure | |
| Transfer Time | |
| UL 94 Rating | The UL 94 standard classifies plastics according to how they burn in various orientations and thicknesses. From lowest (least flame-retardant) to highest (most flame-retardant): HB: slow burning on a horizontal specimen; burning rate particles allowed as long as they are not inflamed. V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. 5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole. 5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole. |
| UL Rating | |
| UL94 @ 1/4 inch | |
| UL94 @ 1/8 inch | |
| Vapor Density | |
| Vapor Pressure | |
| Viscosity | |
| Viscosity @ 25°C | |
| Viscosity @ 60°C | |
| Visible Light Transmission | |
| VOC-Free (100% solids content) | VOC means Volatile Organic compound. VOCs are evaporating molecules and are literally everywhere around us. Our scents are volatile organic compounds, most of the things that we smell are VOC etc. So what do we mean when we state that a product is VOC free? A VOC free product, according to the FTC is one where: 1)VOCs have not been intentionally added to the product. 2)The presence of VOCs at that level does not cause material harm that consumers typically associate with VOCs, including but not limited to, harm to the environment or human health. 3)The presence of VOCs at that level does not result in concentrations higher than would be found at background levels in the ambient air. |
| Volume Resistivity | Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface. |
| Water Absorption @ 23°C/24h | |
| Water Contact Angle | |
| Weight Loss @ 300°C | |
| Width | |
| Work life @25°C | Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements. |
