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Glossary of Product Properties and Test Parameters

This glossary contains descriptionriptions of key material properties, so that the user can better understand the products capabilities and limitations.

It is important to note that not all products are necessarily tested agains the same conditons, as they are not all necessarily relevant to either the product or the application

Tag NameDescription
5% Weight Loss Temperature
Adhesion StrengthAdhesion is the bond strength measurement of a coating to a substrate. When an adhesive is bonded to an item or surface, numerous physical, mechanical and chemical forces come into play, which may have an effect on each other.
Adhesive LayerA layer that is applied to one surface or both to bind items together and resist their separation
Adhesive ThicknessThickness of the adhesive layer.
Air PermeabilityThe air permeability of a fabric is a measure of how well it allows the passage of air through it.
Alloy CompositionComposition of the alloy material
Alloy TypeA metallic element type
Aluminum (Al)Aluminium is a metallic element with a silvery-white, soft nonmagnetic, ductile elements that has a melting point of 660.3 C
Antimony (Sb)Antimony is a lustrous gray metalloid found in batteries, low friction metals, cable sheating and among other products
Appearance at Room Temperature
Arc ResistanceASTM-D495 expresses arc resistance as the number of seconds that a material resists forming a surface-conducting path when exposed to a high-voltage, low-current arc occurring intermittently. Results obtained from a nominal 3 mm thickness are meant to represent the material’s reaction in any thickness.
Auto CSV GenerationCSV (comma-separated values) is a simple data file for spreadsheet software.
Auto ignition temperature
Auto PDF GenerationPDF (Portable Document Format) will convert a generated document into a pdf file
Barcol Hardness (Type 935)
Basis WeightBasis weight refers to the weight measured in pounds off 500 sheets of paper in that paper’s basic sheet size.
Battery Included
Battery TypeSpecific types of battery that can vary from Nickel Cadmium, Nickel-Metal Hydride, Lead Acid Battery, Lithium Ion battery and more.
Benzene Adsorption
Bismuth (Bi)Bismuth is a chemical element with symbol Bi and atomic number 83. Bismuth is the most naturally diamagnetic element, and has one of the lowest values of thermal conductivity among metals.
Boiling PointThe amount of degree’s needed to reach in order to make the substance boil.
Breakdown VoltageThis electrical property is thickness dependent and is the maximum amount of voltage that a dielectric material can withstand before breaking down. The breakdown voltage is calculated by multiplying the dielectric strength of the material times the thickness of the film.
Bulk DensityThe amount of a certain product that comes in a bulk.
CertificationsConfirmation of tested functions, characteristics of a product.
Chemistry Type
Chloride (Cl-)
Chromium (Cr)Chemical element with a steely-grey, hard and brittle metal, resists tarnishing and has a high melting point.
Coating Thickness
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α2
ColorThe color
Conductivity
Connection InterfaceIs an interface between two pieces of equipments that functions such as passing messages, connecting and disconnecting, etc.
Continuous Operating Temperature
Copper (Cu)Copper is a soft malleable and ductile metal with a very high thermal and electrical conductivity.
Copper (Cu)
Curing
Curing Time @ 150°C / 302°F
Curing Time @ 160°C / 320°F
Curing Time @ 170°C / 338°F
Curing Time @ 175°C / 347°F
Curing Time @ 175°C / 347°F (Automold)
Curing Time @ 175°C / 347°F (Conventional Mold)
Curing Time @ 190°C / 374°F
Curing Time @ 190°C / 374°F (Automold)
Curing Time @ 210°C / 410°F
Cut Through Temperaturethe thermal resistance temperature/ durability
Data Storage CapacityThe amount of readings that can be stored in the device
Decomposition Temperature
DensityVolumetric mass per unit
Diameter
Dielectric Constant (IPC-TM-650 2.5.5.9) 1.5 GHz
Dielectric Constant @ 1000 kHz
Dielectric Constant @ 150 ˚C/1 kHz
Dielectric Constant @ 150 ˚C/10 kHz
Dielectric Constant @ 150 ˚C/100 kHz
Dielectric Constant @ 23 ˚C/1 kHz
Dielectric Constant @ 23 ˚C/10 kHz
Dielectric Constant @ 23 ˚C/100 kHz
Dielectric Constant @ 25 ˚C/100 kHz
Dielectric Constant @ 25 ˚C/1000 kHz
Dielectric StrengthThe maximum electric field that a pure material can withstand under ideal conditions without breaking down
Dissipation Factor (IPC-TM-650 2.5.5.9) 1.5 GHz
Dissipation Factor @ 23°C /1 kHz
Dissipation Factor @ 23°C /10 kHz
Dissipation Factor @ 23°C /100 kHz
Dissipation Factor @ 25°C /100 kHz
Dissipation Factor @ 25°C /1000 kHz
Dissipation Factor @ Imc
Durometer (Shore A)
Dynamic Tensile Modulus cured with 2% Dicumyl Peroxide @ -65°C
Dynamic Tensile Modulus cured with 2% Dicumyl Peroxide @ 150°C
Dynamic Tensile Modulus cured with 2% Dicumyl Peroxide @ 25°C
Edge Coverage
Electrical ResistivityIs an intrinsic property that quantifies how strongly a given material opposes the flow of electric current
ElongationThe action or process of lengthening something
Eutectic Melting Temperature
Evaporation Rate
Fabric ThicknessDetermines the thickness accurately and conveniently of the fabric
Filler Content
Filler Size Cut
Film ThicknessBacking Film Thickness
Film Thickness
Flammability
Flash Point
Flash, 0.25mil channelFlash in millimeters in a 0.25mil deep channel
Flash, 0.5mil channelFlash in millimeters in a 0.5mil deep channel
Flash, 1mil channelFlash in millimeters in a 1mil deep channel
Flash, 2mil channelFlash in millimeters in a 2mil deep channel
Flash, 3mil channelFlash in millimeters in a 3mil deep channel
Flexural Modulus @ 21°CFlexural Modulus taken at 21°C
Flexural Modulus @ 220°CFlexural Modulus taken at 220°C
Flexural Modulus @ 25°C
Flexural Modulus @ 260°CFlexural Modulus taken at 260°C
Flexural Strength @ 21°C
Flexural Strength @ 220°CFlexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 220°C
Flexural Strength @ 240°CFlexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 240°C
Flexural Strength @ 25°CFlexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
Flexural Strength @ 260°CFlexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 260°C
Flow Rate @ 200°C
Functionality
Gel Time @ 160°C / 320°F
Gel Time @ 175°C / 347°F
Gel Time @ 177°C / 351°F
Glass Plate Flow @ 150°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg) cured with 2% Dicumyl Peroxide (DMA method)
Glass Transition Temperature (Tg) cured with 2% Dicumyl Peroxide (TMA method)
Heat Distortion TemperatureThe temperaturea t which a polymer or plastic sample deforms under a specified load
Heat Seal Pressure
Heat Seal Temperature
Heat Seal Time
Heat Sealable
Hot Hardness, Shore D @ 175°C / 347°F after 90 seconds
Impact Strength
Iodine Adsorption
Iron (Fe)A chemical element with a melting point of 1,538 C
Lead (Pb)
Lead (Pb)
Length
Liquidus Melting TemperaturePointat which an alloy is completely liquid
Loss modulus peak @ DMA
Magnesium (Mg)
Melting temperature
Mix RatioThe amount of a constituent divided by the total amount of all other constituents in a mixture
Moisture Absorption @ 23°C/ 50%RH /24h
Moisture Absorption, 168 hrs @ 85ºC/85% RH
Moisture Absorption, 24 hrs PCT
Molded Shrinkage
Molding Temperature
Molecular weight
Nickel (Ni)
Number of Bags
Number of Uses
Oil Contact AngleThe contact angle is the angle, conventionally measure trough the liquid, where a liquid-vapor interface meets a solid surface.
Particle Size thru 325 mesh
Particle Size thru 80 mesh
Peel StrengthMeasure the bond strength of a material
pH of extract
PorosityVoid fraction is a measure of the void spaces in a material
Post curing (minimum)Process of exposing a part of mold to elevated tempertures to speed up the curing process and to maximize some of the material’s physical properties.
Post Mold Cure @ 150°C / 302°F
Post Mold Cure @ 175°C / 347°F
Pot LifeIs defined as the amount of time it takes for an initial mixed viscosity to double, or quadruple for lower viscosity products. (
Potassium (K)
Potassium (K+)The amount of Potassium (K+) ion extracted from the epoxy mold compound in parts per million (ppm)
Pre-Heating (optional)
Preheat Temperature
Process Method
Recording Cycle
Recording Interval
Release LinerA paper or plastic-based film sheet used to prevent a sticky surface from premturely adhering
Reprogrammable
RoHS CompliantRoHS (Restriction of Hazardous Substances) restricts teh use of specific hazardous materials found in the electrical and reflectivity of any metal.
Shear Strength
Sheet Size
Shelf Life @ -20°C
Shelf Life @ -4°C
Shelf Life @ -40°C
Shelf Life @ 15°C
Shelf Life @ 4.5°C
Shelf Life @ 5°C
Silver (Ag)
Single- or Double-Sided AdhesiveDescribes whether a tape is single- or double-sided. If it is single-sided, it has adhesive only on one side of the backing film. If it is double-sided, then it has adhesive on both sided of the backing film.
Sodium (Na)
Sodium (Na+)
Software
Solids
Solidus Melting Temperature
Special Layer
Special Layer Thickness
Special Properties
Specific Gravity
Specific Gravity 250°C
Specific Surface Area (BET)
Spiral Flow @ 175°C / 347°F
Spiral Flow @ 177°C / 351°F
Startup Mode
Stop Mode
Storage (DMA) Modulus @ 175°C
Storage (DMA) Modulus @ 25°C
Storage (DMA) Modulus @ 260°C
Storage Temperature
Surface Resistivity
System
Tan δ peak @ DMA
Temperature Accuracy
Temperature Range
Temperature ResistanceTemperature resistance is the maximum temperature that the material or product can withstand for a period of time. The temperatures listed should be considered as guidelines for an operating temperature of about 30 minutes. Typically, the material can withstand much longer times at temperatures about 20°C lower and can withstand much higher temperatures for short, intermittent times.
Temperature Resolution
Tensile Modulus @ 21°C
Tensile Strength
Tensile Strength (Thin Film)
Tensile Strength @ 21°C
Thermal Conductivity
Tin (Sn)
Total Thickness
Transfer Pressure
Transfer Time
UL 94 RatingThe UL 94 standard classifies plastics according to how they burn in various orientations and thicknesses. From lowest (least flame-retardant) to highest (most flame-retardant): HB: slow burning on a horizontal specimen; burning rate particles allowed as long as they are not inflamed. V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. 5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole. 5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole.
UL Rating
UL94 @ 1/4 inch
UL94 @ 1/8 inch
Vapor Density
Vapor Pressure
Viscosity
Viscosity @ 25°C
Viscosity @ 60°C
Visible Light Transmission
VOC-Free (100% solids content)
Volume ResistivityVolume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Water Absorption @ 23°C/24h
Water Contact Angle
Water Extract Conductivity
Water Extract pH
Weight Loss @ 300°C
Width