Dam |
Loctite ECCOBOND 7010C DAM | Protection of bare IC, Well defined height | 92,500 | Silica (80%) | 120 | SVHC free | 140 | 16 | 63 | 60 - 60 | 100 + 150 |
Loctite ECCOBOND EO 7029 | Smartcard encapsulation and die attach | 48,000 | - | - | - | 110 | 66 | 181 | 5 | 150 |
Loctite ECCOBOND FP4451TD | BGA and memory encapsulation. Highest aspect ratio for Tall Dam | 300,000 | Silica (73%) | 200 | Anhydride | 150 | 21 | 65 | 30 + 90 | 125+165 |
Loctite ECCOBOND FP4451 | Discontinued - No longer available | 300,000 | Silica (72%) | - | Anhydride | 155 | 22 | - | 30 + 90 | 125+165 |
Fill |
Loctite ECCOBOND 7010C FIL | Potting or encapsulation protection for stress sensitive components | 25,000 | Silica (80%) | 120 | SVHC free | 140 | 16 | 58 | 60 + 60 | 100 + 150 |
Loctite ECCOBOND FP0087 | Stress-sensitive devices and severe automotive environments | 20,000 at 20 rpm | Silica (76%) | N/A | Anhydride | 175 | 18 | 69 | 60 + 60 | 125 + 180 |
Loctite ECCOBOND FP4450 | Discontinued - No longer available | 44,000 | Silica (73%) | 120 | Anhydride | 155 | 22 | 72 | 30 + 90 | 125+165 |
Loctite ECCOBOND FP4450HF | Automotive, BGA, memory, COB, SIP and SmartCard | 32,000 at 20 rpm | Silica (73%) | 25 | Anhydride | 164 | 19 | 71 | 30 + 90 | 125+165 |
Loctite ECCOBOND FP4470 | BGA, CSP, and full array on low temperature co-fired ceramic (LTCC) | 48,000 | Silica (75%) | 50 | Anhydride | 148 | 18 | 65 | 30 + 90 | 125+165 |
Loctite ECCOBOND FP4650 | High purity and low thermal expansion | 325,000 | Silica (83%) | - | - | 140 | 15 | - | 60 + 120 | 120 + 160 |
Loctite ECCOBOND FP4651 | Automotive, BGA, memory, COB, SIP, SmartCard and chip array ceramic packages | 130,000 at 20 rpm | Silica (82%) | 50 | Anhydride | 150 | 12 | 50 | 60 + 90 | 125+165 |
Locite ECCOBOND FP4653 | Chocolate breakable on pre-scored ceramic substrate | 85,000 | Silica (86%) | - | - | 150 | 7 | - | 120 + 120 | 110 + 150 |
Loctite ECCOBOND FP4654 | Discontinued - No longer available | 32,000 at 20 rpm | Silica (80%) | 50 | Anhydride | 146 | 13 | 53 | 30 + 90 | 125+165 |
Loctite ECCOBOND FP4802 | BGA, CSP and full array on low temperature co-fired ceramic (LTCC) | 80,000 at 10 rpm | Silica (72%) | 50 | Phenolic | 50 | 20 | 100 | 30 + 90 | 125+165 |
Loctite STYCAST A316-48 | Automotive grade potting material with High Tg for sensors and control modules | 50,000 | Oxide | - | Amine | 145 | 55 | 155 | 30 + 120 | 100 |
Glob Top |
Loctite ABLESTIK ME 995-1-4 | Thermally conductive glob top | 205,000 | Silica | - | - | 110 | 45 | - | 60 | 150 |
Loctite ECCOBOND EN 3838T | Low temperature cure PCB protection | 6,700 | - | - | - | 2 | 57 | 217 | 8 | 130 |
Loctite ECCOBOND EO 1016 | Encapsulation of smart cards and watch ICs | 62,000 | Alumina | N/A | Amine | 126 | 46 | 140 | 20 | 150 |
Loctite ECCOBOND FP4323 | COB and plastic PGA encapsulation | 220,000 at 2 rpm | Silica (65%) | - | - | 174 | 28 | - | 240 or 60 | 150 or 170 |
Loctite ECCOBOND FP4460 | Automotive, BGA, memory, COB, SIP and SmartCard | 300,000 at 10 rpm | Silica (75%) | 120 | Anhydride | 173 | 20 | 70 | 180 | 150 |
Loctite ABLESTIK 8387BM | Discontinued - No longer available | 14,000 | PTFE, Silica | 10 | Hybrid Epoxy | 122 | 88 | 168 | 5 or 60 | 150 or 100 |
Loctite ECCOBOND 50300HT | Wire bonded bare die encapsulation | 130,000 | Silica (68%) | 150 | Anhydride | 140 | 20 | - | 60 + 60 | 120 + 150 |
Loctite ECCOBOND 50300-1 | Wire bonded bare die encapsulation | 100 | Silica(70%) | - | - | 140 | 20 | - | 120 | 150 |
Loctite ECCOBOND 50300LT | Wire bonded bare die encapsulation | 55 | Silica (69%) | - | - | 140 | 20 | - | 120 | 150 |
Loctite ECCOBOND 50400-1 | Wire bonded bare die on epoxy laminates | 40,000 at 20 rpm | Silica(70%) | 150 | Amine | 140 | 20 | - | 60 + 60 | 120 + 150 |
Loctite ECCOBOND FP4660 | CSP and low stress applications | 120,000 at 5 rpm | Silica (80%) | 120 | Anhydride | 135 | 13 | 56 | 30 + 90 | 125+165 |
Loctite ECCOBOND UV8800M | Discontinued - No longer available | 2,500 - 4,000 at 5 rpm | Silica (54%) | 21 | - | 29 | 41 | 135 | 2 seconds | 315 - 400 nm (UV) |
Loctite ECCOBOND UV8800M-X | Discontinued - No longer available | 3,400 | - | - | - | 47 | 48 | 149 | 30 sec | 100 mW/cm2 |
Loctite ECCOBOND UV 9052 | UV cure for inkjet applications | 41,000 | - | - | - | - | - | - | 5 - 10 sec | 0.5 - 1 J |
Loctite ECCOBOND UV 9060F | Protection of WLCSP and BGA | 11,000 | - | - | - | 75 | 81 | 198 | 5 - 25 sec | 300 w/In |
Loctite EO7021 | CSP, BGA and SmartCard encapsulation | 17,000 at 5 rpm | - | - | - | 125 | 67 | 187 | 60 or 5 | 120 or 150 |
Loctite SI 5088 | UV and moisture cure for gasketing and sealing on glass, metals and ceramics | 65,000 | Unfilled | - | Silicone | - | 3 | - | Mix | Mix |
Loctite SI 5293 | UV cure silicone for PCB protection | - | - | - | Silicone | -40 | 300 | - | - | - |
Loctite STYCAST 2851FT | Solvent free encapsulant | 85,000 | - | - | - | - | 31 | - | 60 | 120 |
Loctite STYCAST SC3613 | LED display coating and IC hybrid passivation | 3,500 | Unfilled | - | Silicone | - | - | - | 30 + 60 | 120 + 150 |
Loctite STYCAST U2500 | For transformer PCBs and insulation apps | 6,000 | Polyurethane | - | - | -53 | 155 | - | 240 | 60 |