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Quad-flat no-leads (QFN) and dual-flat no-leads (DFN) packages are used to physically and electrically connect integrated circuits to PCBs. They are leadframe based chip scale packages with pads instead of legs or pins for their electrical connections.
Molding compounds for QFN packages don't just need to be high end with high filler loading. They also need to have low stress, low moisture absorption, high adhesion, low viscosity and more.
For example a lower release force of a product from the GR 900 product line can help the production line with more continuous mold shots. Or a good adhesion force post mold cure and after MSL testing makes sure that we will have a good delamination performance.
We want to make sure that the packages will pass all Reliability tests such as SAT, PCT, TCT, HTST and THT without any defects. The products need to have excellent copper wire compatibility, good fluidity to avoid wire sweeping and also meet UL94 V0 rating.
To add to this list of requirements, MSL3-MSL1 260°C is a plus and also the material needs to be "Green" without Br/Sb and comply with Rohs. Simple, right?
That's why we singled out some products that we recommend to mold a QFN package and they are:
These are high end epoxies with high spherical silica loading. Their excellent properties such as low CTE, lost stress, low water absorption, low shrinkage and low ionics ensure the package reliability.
Property / Product
Unit of Measure
Hot Plate Gel time, @ 175°C
Spiral Flow @ 175°C