Additives

Performance Enhancing Additives

AVAILABLE DIRECTLY AT CAPLINQ.COM
AdditivesBismaleimides (BMI)High Purity AluminaHigh Purity SilicaReactive Silicones

Additives

Additives are specialty chemicals that are added to base-chemistries to improve performance. These additives are often blended into the epoxy molding compounds, silicones, epoxy coating powders and other polymers to improve some aspect of performance. CAPLINQ offers a range of specialty additives to be used in our own chemistries or they can be used to improve the performance of your own materials.
Categories
Filters
Filters
Reset All Filters
Compare Products
  • Recommended
  • Price Low > High
  • Price High > Low
24 products
Compare Products
  • Recommended
  • Price Low > High
  • Price High > Low
24 products

Product Selector Guide

Anti-bleed Additive

 

Product Chemistry/Description Application/Features
A1050 Antibleed Additive | Non halogenated

Superior compatibility with metal filler systems such as silver. Improved bleeding properties: Non-metal filled systems ex. silica
Recommended formulation: 0.5% - 1.0%
A1100 Antibleed Additive | Non halogenated Designed for metal surfaces with more acid functionality.
Improved bleeding properties: Non-metal filled systems ex. silica
Recommended formulation: 0.5% - 1.0%
A6225 Antibleed Additive | Non halogenated Universal additive |
Excellent compatibility: Silver
Improved bleeding properties: Non-metal filled systems ex. silica
It also provide mold release and surface atnti stiction properties.
Recommended formulation: 2% - 4%
A6280 Antibleed Additive | Non halogenated

Excellent compatibility: Gold surfaces

Designed for Non-metal filled systems

Minimal or no affect on the adhesion properties of the formulation.
Recommended formulation: 0.5% - 1.0%
A6165 Electrical Conductivity Enhancer

Use as an additive in combination with metal fillers (e.g. silver or Ag coated Cu) to further
decrease volume resistivity in electrically conductive adhesive compositions.
Recommended formulation: < 1.0%

 

Adhesion Promoter Additive

 

Product Chemistry/Description Application/Features
A304 4-Meta (Methacryloxyethyl trimellitic anhydride) Adhesion Promoter Additive

Reactive Primer specific for dental application

Enhance monomer penetration into dentin pretreated with 10% citric acid and 3% ferric chloride
A478-M PMDM-M (Pyromellitic Dianhydride Dimethacrylate) Adhesion Promoter Additive PMDM-M chemistry is a cheaper option for dental adhesive application
A675-100 PMDGM (Pyromellitic Dianhydride Glycerol Dimethacrylate Adduct) Adhesion Promoter Additive Adhesion enhancement where four methacrylate groups and two carboxylic groups per molecule allow bonding to a variety surfaces.
MM211 Maleimide Adhesion Promoter Additive | Flexible Aliphatic backbone Use as intermediate for the synthesis of ester and amide linked thermoset monomers, as well as maleimide functional resins 
MM281 Maleimide Adhesion Promoter Additive | Flexible Aliphatic backbone | Long Aklyl Chain Main difference from MM211 is the twice as long alkyl chain
MM290 Acrylate Adhesion Promoter Use in UV or peroxide cure formulations and applications that require hydrolytic resistance | Mild odor
MM304 Methacrylate adhesion promoter Additive Use as a reactive diluent monomer for use in UV or peroxide cure formulations.

 

Base Resin

 

Product Chemistry/Description Application/Features
PEAM-1044 Low warpage Polyester Acrylate/Methacrylate High thermal stability and low volatility | Use as a base resin in a formulation or an additive | Exceptionally low warpage with the addition of polybutadiene type resins
PEAM-1769 Difunctional (meth)acrylate Use as a base resin or an additive to reduce stress | Excellent adhesion on most substrates with low stress and low shrinkage due to its high Tg polycyclic repeat units.
PEAM-645 High Tg Polyester Acrylate/Methacrylate Use as a base resin in adhesive applications or coating applications | Exhibits low CTE, high Tg, and high modulus.
PEM-665 Methacrylate terminated polyester  Use as a base resin in dental applications | Good solubility in both aliphatic and aromatic co-monomers.

 

Universal Additive

 

Product Chemistry/Description Application/Features
Benzimidazole Benzimidazole | Latent curing Agent For Epoxy Resins Reacts at elevated temperatures makes it ideal for enhancing the thermal stability and mechanical properties of epoxy mold compounds. 
CHEMLINQ AL20-2B Triethylenetetramine (TETA) | Corrosion Inhibitor | Accelerate Curing Process | Fuel Additive Premier epoxy curing agent that accelerates the curing process and can produce durable coatings in adhesives, composites, and coatings
CS-697 Polyglycidyl Ether Cyclosiloxane For Adhesive formulation base resin with compatibility with most organic resins.
Dow Corning Toray SF-8421 EG Fluid | EMC Internal Release Agent Additive Formulated for compatibility with EMC wherein the main purpose is to reduce stress and improve flowability of the mold compound | Excellent compatibility with epoxies and silicones
MM204 High Tg Mono-Functional Acrylate Monomer Use as a reactive diluent for UV or peroxide cured resins, coatings or adhesives |  Improve stereolithographic processes for high-temperature applications.
MM220 Low viscosity mono-acrylate monomer  Use as reactive diluent for UV or peroxide cured resins, coatings and adhesives | Polycyclic ring structure helps minimize shrinkage on cure