CS-783 | Methacrylated Epoxy Functional Hybrid Cyclosiloxane

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

CS-783 | Methacrylated Epoxy Functional Hybrid Cyclosiloxane

Main features

Low viscosity
Dual cure mechanism
Multifunctional

Product Description

DMI CS-783 is a methacrylated, epoxy-functional hybrid cyclosiloxane monomer engineered to enhance adhesion and compatibility in advanced resin systems. Its unique structure allows participation in both free-radical polymerization and epoxy curing mechanisms, offering broad versatility for formulating high-performance adhesives, coatings, and composite materials.

Used primarily as an adhesion promoter for mold compounds, metal surfaces, and polyimides, DMI CS-783 improves interfacial bonding without sacrificing processing ease. Additionally, it serves as a multifunctional diluent, reducing viscosity and enhancing flow properties across a wide range of resin systems. Soluble in most common resins, DMI CS-783 simplifies formulation without compromising performance.

Applications

Adhesion promoter for mold compounds, metals, and polyimide surfaces
Reactive diluent for epoxy, hybrid, and UV-curable systems
Formulations requiring dual-cure compatibility (free-radical and epoxy cures)
B-staged and hybrid adhesives, coatings, and composites

Specifications
Additional Information

Technical Specifications

General Properties
Appearance Appearance Appearance at room temperature.	Yellow liquid
Molecular weight	783 g/mol
Physical Properties
Viscosity Viscosity Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application	250 mPa.s

Additional Information

Recommended Formulation Use

CS-783 is recommended for use as an adhesion promoter to mold compounds and metal substrates. Typical addition levels are 1-5% of the total resin. CS-783 can also be used for standard epoxy curatives, catalysts, B-staged and/or hybrid adhesives.