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Reliability

Reliability testing

Material, Stress, Mechanical and Environmental induced mechanisms

TC, TCT, HTOL, HAST, HTS

Preconditioning

Preconditioning tests are being done to determine the workability of semiconductor devices after soldering. They simulate the delivery from the assembly house up to the soldering process at the customer's plant.

They are based on the JEDEC standard for the preconditioning of non hermetic surface mount devices, prior to reliability testing.

Preconditioning is a series of 

  1. Electrical tests
  2. Non destructive SAM inspection
  3. Simulate Temp changes during transportation to the customer
  4. Simulate the Drying process of the silica gel by dry pack
  5. Simulate Moisture absorption in the production line
  6. Simulate Soldering process
  7. Repeating the first two tests and deciding whether the package is still suitable

Typical Failure modes after Preconditioning tests:

  • Package crack
  • Delamination
  • Electrical Open/Short