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Scanning Acoustic Microscopy in C mode produces a two dimensional image of ultrasound echoes reflecting up to a specified depth. It is very sensitive to defects on the interface such as air, voids, gaps that are a result of the delamination of the die pad, leadframe or any part of the package. Since echose won't travel through the air gaps, it has a very high efficienty and reliability on detecting delamination and distinguishing between good and bad packages. On the same note it detects cracks and any other failure mode that might affect the reflection of the ultrasound.
Various delamination types and spots