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Non conductive adhesives can withstand high thermal loads and can potentially provide high shock and peel resistance. They demonstrate excellent chemical resistance, thermal shock and impact resistance while also maintaining a wide operating temperature range.
Our range of Non conductive adhesives (NCA) can achieve great bonding to a variety of substrates while also being thermally and chemically resistant.These Henkel adhesives are designed for us in temperature sensitive electronics such as CMOS image sensors and in high throughput assembly that requires low temperature cure. With an operating temperature range between -40ºC to 130ºC they are ideal for substrate attachment and can be used for lens holder, lens barrel and IR filter bonding.
NCA dual cure adhesives provide improved adhesion to LCP and aluminium for automotive applications and they can be used for automatic dispensing, screen printing and led applications. Their flexibility derives from the fact that they can be dual cured but can also be used either as a single component or two component epoxies with a resin and a catalyst.
*UV Cure Values are indicative of the fixture step. Check the TDS for more information.
Dual cure products are formulated to temporarily cure when exposed to UV light, followed with a secondary thermal cure at low temperature. Temporarily curing the material allows for any necessary adjustments to the final device configuration.
Two-component non conductive adhesives require no refrigeration or freezer storage and include products that provide high peel and tensile lap shear strength over a broad temperature range. Two component epoxies are not premixed so they eliminate pot life issues making them easier to use, transfer, store and preserve.
Key requirements for adhesives that can be used in sensor bonding are:
We offer a wide range of adhesives that are suitable as Lens Holder, Lens Barrel and IR Filter bonding. Depending on the process there are adhesives that are stencil printable or dispensable, UV, Heat or Dual cure and with a high range of viscosity and thixotropy ratings.
The usual process for such bonding starts with dispensing the adhesive and then positioning and aligning the component. Next steps usually consist of fixating the component with light cure that is then finalized with Heat curing.Hence the need for dual curing. It is not necessary but it is process dependent and can help with the precision alignment steps.