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Integrated Circuits

Integrated circuits

SOP, QFP, QFN, BGA, SIP, POP

Leadframe and Laminate

Integrated Circuits

Integrated circuits

Molding compounds for Leadframe Integrated Circuits

 

Package Product Key Feature
SOP Hysol GR 430
Superior Moldability; Lower cost
Hysol GR 530
Up to MSL3; Lower cost
Hysol GR 510
Up to MSL3; Good workability
Hysol GR 510-HP
Up to MSL3; Good workability; Excellent electrical performance at high working temperature(180 degree C)
Hysol GR 510F
Low cost; Good reliability; Good anti-delamination
Hysol GR 700
High adhesion; Low stress; Low moisture absorption; High anti-delamination; High reliability
Hysol GR 710
Low stress; High reliability; High anti-delamination; Superior electrical performance
QFP Hysol GR 510
Up to MSL3; Good workability
Hysol GR 700
Up to MSL1; High adhesion; Low stress; Low moisture absorption; High anti-delamination; High reliability
Hysol GR 710
Up to MSL3; Low stress; High reliability; High anti-delamination; Superior electrical performance
QFN/DFN Hysol GR 900
Good workability; Superior Warpage performance; Good delam & reliability performance
BGA/Sensor Hysol GR 9810-1P
Superior Warpage performance; Up to MSL1
Hysol GR 9810-1PLA
Superior Warpage performance; Up to MSL2; Low Alpha
Hysol GR 910
Superior Warpage performance; Low wire sweep; Good anti-delamination; Good reliability

All products are "Green"

 

Molding Compounds for Laminate Integrated Circuits

 

Package Product Key Feature
MCM Hysol GR 9851MTL
Lower cost; MCM application
SIP/POP Hysol GR 9810-1P
Superior Warpage performance;
Up to MSL2;

All products are "Green"