SOP, QFP, QFN, BGA, SIP, POP

Leadframe and Laminate

Integrated Circuits

Integrated circuits

Package	Product	Key Feature
SOP	Hysol GR 430	Superior Moldability; Lower cost
	Hysol GR 530	Up to MSL3; Lower cost
	Hysol GR 510	Up to MSL3; Good workability
	Hysol GR 510-HP	Up to MSL3; Good workability; Excellent electrical performance at high working temperature(180 degree C)
	Hysol GR 510F	Low cost; Good reliability; Good anti-delamination
	Hysol GR 700	High adhesion; Low stress; Low moisture absorption; High anti-delamination; High reliability
	Hysol GR 710	Low stress; High reliability; High anti-delamination; Superior electrical performance
QFP	Hysol GR 510	Up to MSL3; Good workability
	Hysol GR 700	Up to MSL1; High adhesion; Low stress; Low moisture absorption; High anti-delamination; High reliability
	Hysol GR 710	Up to MSL3; Low stress; High reliability; High anti-delamination; Superior electrical performance
QFN/DFN	Hysol GR 900	Good workability; Superior Warpage performance; Good delam & reliability performance
BGA/Sensor	Hysol GR 9810-1P	Superior Warpage performance; Up to MSL1
	Hysol GR 9810-1PLA	Superior Warpage performance; Up to MSL2; Low Alpha
	Hysol GR 910	Superior Warpage performance; Low wire sweep; Good anti-delamination; Good reliability