EV Batteries

Battery packs

Potting, gasketing and assembling

Room temperature and Heat cure

Battery packs

Encapsulation is one of the main concerns for Lithium-Ion Batteries of electric cars. The encapsulant that is potted within/around the batteries needs to be specially designed as a room temperature curing potting material. Preferably it is of silicone chemistry with thermally conductive fillers that allow low viscosity & low specific gravity. Its critical role in the vehicle's operation dictates that it should meet UL94 V-0 flammability rating and  it also needs to self-level for pouring over/injection over applications. 

The product must be easy to mix and pour or inject so that it can be used for high volume manufacturing. It should also prevent the PCB and electronic components from environmental corrosion, dust, moisture, mechanical damage and help reduce shock and vibration. Ideally it should keep robust performance in heat dissipation, mechanic and electrical insulation under extreme conditions of temperature and humidity.

Material requirements

  • Sufficient thermal conductivity (> 1 W/mK)
  • Electrical Insulation with high dielectric strength
  • Self-leveling for void-free encapsulation
  • Low viscosity to aid the component encapsulation
  • Low compression stress during assembly

Application requirements

  • Light weight with low specific gravity
  • Long-term reliability
  • Stable performance in automotive environment (temp, solvent and humidity)

Processing requirements

  • Suitable for high volume manufacture
  • Easy and fast to apply
  • Cost-effective and reworkable





Low viscosity 
is required to accomodate the encapsulation

Low density is required to keep the weight of the battery pack low.

Low shrinkage and modulus are required to reduce the curing stress on components.

Our suggestion for a silicone, room temperature cure potting product that can cover all of the above is the newly formulated Honeywell's HLT1000P. Go to the product page or contact us with your application requirements for more information.

Base plate cooling

Gap fillers Applicable

Thermal Hybrid: Offer >3.5W/mK thermal conductivity and good long-term reliability; dispensable for automated process.

Thermal Gap Pad: Ultra-high compressibility enables low stress and excellent conformity to mating surfaces with good thermal performance. Honeywell TGP exhibits minimal bleeding and maintain effective performance through reliability testing.