Specialty Chemicals, Adhesives & Plastics
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Two part hybrid thermal gel products are two-component, dispensable, thermally conductive gels, which offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler minimizes oil separation issues in storage.
Those two component, dispensable, thermal hybrid gels require very low compression force and can be used for vertical mounting. Prior to curing, the materials maintain good thixotropic characteristics and low viscosity to be easily dispensed. Additionally they show minimal post cure oil bleeding / separation and no pump out and cracking. Their excellent adhesion and high reliability makes them the top choice for Automotive applications. At the same time the ability to cover varying heights and their end properties make them an ideal thermal interface for MM wave wafer antennas and specifically 5G applications.
Two component hybrid thermal gels can be cured in a short time after two-component mixing at room temperature. HLT series thermal gels require curing but very little pressure during installation (5-10psi or the weight of a heatsink is sufficient). You can speed up the process by curing at elevated temperatures (80 -100°C). The high compressibility minimizes thermal resistance at interfaces, making hybrids ideal for low stress applications while maintaining excellent performance during reliability testing. They are generally considered slower due to the mixing stage but they make up for it with their end properties. They exhibit low contact resistance, long term reliability while they are also easy to dispense and rework.
Thermal Impedance (˚C·in2/W)
*Since those are top of the line products, we go to certain extends to protect Honeywell's IP and competitive advantages. A plethora of information, including additional data, images and samples are available once an NDA is in place. Contact us for more details. (They're really really good)
**Typical values for electrical properties on our high end products are: Dielectric constant@1MHz: 9 and Volume resistivity: 1013Ω*cm
**Lower conductivity materials have much lower filler content and therefore have even higher volume resistivity which makes them more insulative.
No they are not. Why are they called hybrids and not thermal gels then? Hybrids (Both one and two component) share ingredients and compounds between Thermal Gels and Phase Change materials. They combine the best of both worlds and use additives that can be found in Phase Change formulations.
This combination allows the HLT series to reach the highest thermal conductivity in the market (10 w/mK) while at the same time reaching bond lines suitable for 5G Applications. In fact , HLTs are being successfully used by the largest 5G manufacturers in the world.
Typical Two part hybrid gap filler Applications include:
Two part hybrid thermal gels exhibit exquisite thermal characteristics with Thermal conductivity reaching 10 w/mK. But how do those thermal properties change with pressure and bond line thickness?
To identify this we used a TI tester to test thermal impedance under ASTM D5470 requirements. The temperature was kept steady at ~75°C and the sample (a 1" diameter circle) was tested in a pressure ramp starting from 5 and resulting to 50psi. At this point we need to reiterate that we focus on TI, as a more valuable "real life" value and that our properties are never overstated. So what you see in the Technical data sheets is what you get.
As expected, when applying pressure, the bond line thickness drops significantly while at the same time thermal impedance drops too. Those properties tend to stabilize halfway but there's room for improvement for both BLT and TI, which maximize (technically minimize) their values at 50 psi.
It is worth pointing out that HLT10000 is starting with very low Bond line thickness and minimal Thermal impedance that both slightly improve with pressure. It is remarkable that the presureless BLT starts at extremely low BLT while at the same time having an unrivaled TI. This makes HLT10000 the most High end thermal interface material in the market with out of the box properties that are second to none.