HLP 2000 | Two part Thermal potting material

Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other

HLP 2000 | Two part Thermal potting material

Main features

Low Viscosity
2.0 Thermal Conductivity
Room temperature cure

Product Description

Honeywell HLP2000 is a two-part, silicone-based thermal potting material designed to provide both superior heat dissipation and protective encapsulation for sensitive electronics. With a thermal conductivity of 2.0 W/m·K and low viscosity (6000 cps), it flows easily to encapsulate components, making it ideal for automotive, LED, photovoltaic, and industrial power applications.

Honeywell HLP2000 cures at room temperature and can be heat-accelerated for faster processing. Beyond thermal management, HLP2000 also safeguards electronic assemblies from environmental stress—like humidity, dust, or vibration—extending the operational life and reliability of the complete module.

Applications

Automotive electronics
Industrial power supplies
Photovoltaic inverters
LED modules and lighting systems

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Grey

Mix Ratio

Mix Ratio
The amount of a constituent divided by the total amount of all other constituents in a mixture

1:1

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

2.2

Curing Schedule

Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.

Cure Type

RT cure

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 25°C	273 days

Physical Properties

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

6000 mPa.s

Mechanical Properties

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore 00)	55

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

1.0x10¹⁵ Ohms⋅cm

Thermal Properties

Operating Temperature

-40 - 200 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

2.0 W/m.K

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0

Curing Conditions

Curing Schedule

Cure Time

1440 @25C, 60 @80C min

Additional Information

Storage and Handeling

Shelf life: 9 months at Room Temperature
Storage: Store in a well-ventilated area. Keep the container closed when not in use, and keep it away from direct sunlight.
Processing: Mix at a 1:1 ratio by weight. The material cures in 24 hours at room temperature or within 1 hour at 80 °C. Before use, ensure both parts are thoroughly mixed. Store in a well-ventilated area and protect from direct sunlight. Always keep containers sealed when not in use.