Integrated circuits

SOP, QFP, QFN, BGA, SIP, POP

Leadframe and Laminate

Dual In Line (DIL) Quad Flat No Lead (QFN/DFN) Small Outline Package (SOP) Intelligent Power Module

Intelligent Power Module

Application Introduction

IPM (Intelligent Power Module) is a high-performance module that mounts a dedicated drive circuit for drawing greater performance from an IGBT chip, and it provides a custom IC for executing self-protection functions (short circuit, supply under voltage, and over temperature). Intelligent power modules are widely used in motor control such as industrial motor drives, but also in uninterruptible power supplies, inverters, and renewable energy systems. Typical applications are like:

Home appliances: fans, air purifiers, washing machines, air conditioners, refrigerators, vacuum cleaners
Industrial: pumps, compressors, HVAC, elevators
Automotive: AC compressors, oil pumps, on-board charging in electric vehicles

An IPM incorporates a control IC that has an IGBT drive circuit and a protection circuit. Thus, it is highly integrated as:

There are several package designs of IPM according to the size. Take Mitsubishi Electric’s modules as example:

Speaking of power module, you may be familiar with discrete module devices with TO package, such as SiC MOSFET or 6-in-1 power modules used in Power Inverters, According to "Power Module Packaging 2018: Material Market and Technology Trends report" by Yole Développement, the different packages of power module devices (discrete TO package, IPM, 6-in-1 power modules) are applied in different applications based on power needs and integration requirements.

IPM Encapsulation Solutions

IPM Package Types

Based on the design of power modules, the encapsulation solutions are transfer molding encapsulation using Epoxy Molding Compound and direct potting using Liquid Encapsulants (epoxy resin or silicone resin). For IPM, due to its highly integration, EMC molding is widely adopted. The internal structure depends on IPM sizes. See Mitsubushi IPM series design at the right figure.

Power Module Encapsulation Solutions

Internal structure (clockwise): SLIMDIP, Super Mini DIPIPM, and Large DIPIPM (Source: Mitsubishi)

Epoxy Molding Compound For IPM Application

Hysol has developed different series (GR60 series, GR600 series, GR750 series, etc.) for IPM application. Highly conductive versions are also in development.

GR60 Series For IPM Application

Hysol GR60 series products are highly thermal conductive molding compounds designed for IPM applications. Both GR60 HT and GR60 PT are dedicated to module package with excellent workability and reliability, suitable for long wire or large body device. The key common features of GR60HT and GR60PT are:

Workability

No wire sweep
Warpage control
Wide molding window

Great peformance

Good electrical stability during tests
High thermal conductivity
Flammability rating UL94 V-0 @1/8 inch

Meanwhile, they have their own unique features to meet niche requirements for your module. The differences between GR60 PT and GR60 HT:

Thermal conductivity: 1.7 W/mK (GR60 PT) v.s. 2.2 W/mK (GR60 HT)
Good adhesion to: Cu & Au surface (GR60 PT) v.s. Cu & Au & Ni surface (GR60 HT)
Others: high cost-efficient (GR60 PT) and good moisture resistance (GR60 HT)

Power Module EMC Selection

Hysol and LINQSOL EMC Selection Guide for Power Modules

This guide helps identify suitable epoxy molding compounds for power modules based on package family, voltage class, thermal load, wire configuration, leadframe interface, moldability, and reliability target. Rows are organized by package family, including T-PAK, SOT227, direct-cooling modules, and intelligent power modules, with additional options for adjacent power package requirements.

Product	Key Benefit	Typical Use Case
T-PAK
Hysol GR700	Advanced power reliability solution Low-stress behavior supports high-power leadframe packages where electrical reliability and moisture resistance are important	T-PAK and related transfer-molded power leadframe packages where voltage class, leadframe interface, and package reliability drive screening
Hysol GR750	SiC/GaN reliability option Suited for requests involving high-voltage reliability, high-temperature operation, and moisture resistance	T-PAK power packages where SiC, GaN, IGBT, voltage class, and high-temperature operation become primary selection triggers
Hysol GR600-P1	Broad discrete package compatibility option Electrical performance combined with thermal cycling reliability for power leadframe packages	T-PAK, DPAK, D2PAK, and related leadframe power packages where the design is closer to power discrete architecture than full module molding
SOT227
Hysol GR750	High-voltage focused solution High-temperature electrical reliability supports isolated power packages with stronger voltage and moisture-reliability demands	SOT227 packages where high voltage, reverse-bias reliability, and high-temperature operation drive material screening
Hysol MG15F-0140B	High-temperature electrical reliability solution Positioned for high-voltage power packages requiring stable electrical behavior at elevated temperature	SOT227, high-voltage rectifier, and power discrete packages where electrical stability under bias is a key selection trigger
LINQSOL EMC-7535MF	High-voltage and high-power reliability solution Used when voltage class, thermal cycling exposure, and low-stress encapsulation become stronger screening drivers	SOT227 and high-power TO-adjacent packages where voltage class, thermal cycling exposure, and reverse-bias reliability are central requirements
LINQSOL EMC-7560	SiC/GaN reliability option Positioned for SiC power reliability, high-temperature operation, and reverse-bias reliability	SOT227 and SiC power packages where moisture resistance, voltage class, and high-temperature operation drive material evaluation
Single / Dual Side Cooling Direct Cooling Module
Hysol GR730HT	High thermal conductivity and insulation performance High thermal performance combined with low-stress behavior for direct-cooling power module packages	Single or dual side cooling direct-cooling modules where heat dissipation, delamination resistance, and thermal cycling exposure are primary selection triggers
LINQSOL EMC-G375	Heat-dissipation focused solution Applied where heat dissipation, fullpack insulation, and thermal cycling exposure become dominant screening drivers	Direct-cooling power packages where heat dissipation, insulation margin, and thermal cycling exposure are central requirements
LINQSOL EMC-5013	Mid-to-high thermal performance solution Suited for fullpack insulation, low porosity, and higher thermal performance requirements	Direct-cooling and fullpack power packages where electrical isolation, heat dissipation, and encapsulation quality drive screening
Hysol GR750	Advanced power reliability solution High-temperature electrical reliability supports direct-cooling modules where SiC, GaN, or IGBT conditions drive screening	Direct-cooling power modules where high voltage, thermal cycling exposure, and high-temperature operation are central requirements
Intelligent Power Module
Hysol GR60	Power-module focused option Low-stress behavior supports wire-sensitive module encapsulation and large-body molding stability	Intelligent power modules and partpack modules where wire configuration, package size, and transfer molding stability drive selection
Hysol GR60PT-A	IGBT-module focused option Thermal performance combined with low-stress behavior for fullpack module encapsulation	Intelligent power modules and fullpack IGBT modules where heat dissipation, insulation margin, and module reliability are central requirements
Hysol GR60HT	Thermal performance upgrade Heat-dissipation focused behavior supports module packages where thermal load becomes a stronger screening driver	Intelligent power modules and fullpack modules where heat dissipation requirement and large-body molding stability drive material screening
LINQSOL EMC-6043	Moldability-focused option High flow stability supports SOT and module packages where cavity filling and transfer molding stability are important	Intelligent power modules and adjacent power packages where mold cavity geometry, flow stability, and transfer molding stability become primary selection triggers
Other Options for Adjacent Power Packages
LINQSOL EMC-7535	High-voltage focused solution Positioned for high-power TO packages requiring low-stress encapsulation and electrical reliability	TO power packages and adjacent high-voltage power devices where voltage class and thermal stability drive screening
LINQSOL EMC-1533	Process-economy focused solution Low-stress behavior supports TO and D2PAK-style packages where workability and package stress control are important	TO, DPAK, and D2PAK power packages where process economy, transfer molding stability, and thermal cycling reliability drive material screening
Hysol GR350HT	High-power package thermal option Thermal performance supports TO power packages where high-temperature bias reliability becomes a stronger driver	TO-92, TO-220, TO-247, TO-3P, and adjacent power packages where heat dissipation and reverse-bias reliability drive screening
Hysol GR15F-MOD2C	High-voltage and high-power reliability solution Used when high-voltage operation, SiC reliability, and high-temperature electrical stability drive screening	TO-220, TO-247, SiC MOSFET, and adjacent high-voltage packages where HTRB and high-temperature operation drive material screening
Hysol GR750 X1	Stress-control focused solution Low thermal expansion combined with leadframe adhesion for high-power package reliability screening	SiC, TO-247, TO-263, and related high-power packages where leadframe adhesion and stress control are central requirements
Hysol GR750 X2	High-temperature electrical reliability solution Applied where high-temperature operation, copper adhesion, and high-power device reliability drive screening	TO, ZIP, PentaWatt, HeptaWatt, and related high-power packages where high-temperature operation drives material screening
LINQSOL EMC-G135	Balanced rectifier-focused solution Thermal performance combined with low-stress behavior for bridge and SMX-style power packages	Bridge rectifier and SMX packages where heat dissipation, moldability, and package stress control drive screening

Selection note: Final EMC selection should be confirmed against the actual package outline, leadframe finish, die attach system, wire configuration, mold process window, post-mold cure profile, voltage class, thermal load, and reliability targets such as HTRB, HAST, PCT, TCT, reflow reliability, delamination resistance, crack resistance, moisture resistance, and isolation testing.