Hysol GR600-P1 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Designed for DPAK (TO252) & D2PAK
  • MSL1 Capable on Ni-plating
  • Excellent thermal cycle performance

Product Description

Hysol GR600 Series is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of power discrete semiconductor packages. It is designed with DPAK, D2PAK, TO220 and TO252 in mind. Once molded and post-mold cured, this product provides optimum protection and reliability for these capacitor devices. It is laser markable with low ionic properties that help achieve an excellent thermal cycling performance.

Hysol GR600 is an environmentally "green" product, meaning that it doesn't contain any halogens including bromine, antimony or phosphorus flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on DPAK and D2PAK packages. Its fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. Hysol GR600 meets UL 94 V-0 Flammability at 1/8 inch thickness. Key features are summarized as:

Reliability (Check Test Results)

  • High adhesion to Cu/Ag/Ni
  • Low stress and low water absorption
  • Excellent MSL3/MSL1 delamination performance
  • Excellent performance in HAST, HTRB, TC, PCT, HTS, etc. 


  • Excellent workability with wide process window
  • Excellent cosmetic performance
  • Good flash control
  • Suitable for conventional/MGP mold

Available versions: GR600, GR600P1, GR600SL2, GR600A (Check the GR600 series comparison)

Suitable Package: TO251 (IPAK), TO-252 (DPAK), TO-263 (D2PAK) (Check the D2PAK packaging general requirements)

Product Family
16 mm
7.7 gr
15 kg 10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks Shipping in 12 weeks Shipping in 12 weeks

Technical Specifications

General Properties
The color
Filler Content 88 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -4°C 183 days
Physical Properties
Spiral Flow @ 175°C 34 cm
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
5.9 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
4.9 ppm
Moisture absorption 0.20 %
Electrical Properties
Water Extract Data
Water Extract Data
Water Extract Data, 20hrs water boil
Conductivity 40 mmhos/cm
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
5.6x1016 Ohms⋅cm
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 22500 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
153 N/mm2
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C 82
Molded Shrinkage TBD %
Storage (DMA) Modulus
Storage (DMA) Modulus @ 175°C 954 N/mm2
Storage (DMA) Modulus @ 25°C 27353 N/mm2
Storage (DMA) Modulus @ 260°C 809 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
7.1 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
31 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 27 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
119 °C
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F 120 s
Mold Temperature 175 - 190 °C
Preheat Temperature 70 - 90 °C
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 8 hrs
Transfer Pressure 40 - 150 kg/cm2
Transfer Time 5 - 15 s

Additional Information

Designed for DPAK (TO252) & D2PAK (TO262) Power Discrete Packages

DPAK and D2PAK are power discrete semiconductor packages that are not easy to mold. The package geometry is not very difficult, but once molded, these devices need to be tested under BIAS before and after both humidity exposure and thermal cycling. This test is called the High Temperature Reverse Bias (HTRB) testing and is where most semiconductor epoxy mold compounds fail. Once biased, the device experience "gate leakage" and then fail catastrophically. Furthermore, most DPAK and D2PAK packages are often built using a Nickel (Ni) plating. Nickel is notoriously difficult to adhere to and as such make it difficult to pass high MSL performance levels. DPAK and D2PAK packages are still mature products and as such, the products used to mold them must be cost-competitive. The GR600 EMC is the first product in a series designed to meet all these criteria.

GR600 Series Products Comparison

GR600 Series Reliability Test Results At Customer Sites

Caplinq Cool Supply Chain For GR600 Products